Allicdata Part #: | HM2H67P115LF-ND |
Manufacturer Part#: |
HM2H67P115LF |
Price: | $ 0.53 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | HM2 HDR STYLE AB LF |
More Detail: | 95 Position Shroud for Male Pins Connector Throug... |
DataSheet: | HM2H67P115LF Datasheet/PDF |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
1000 +: | $ 0.47638 |
Series: | Millipacs® |
Packaging: | Bulk |
Lead Free Status / RoHS Status: | -- |
Part Status: | Active |
Moisture Sensitivity Level (MSL): | -- |
Connector Type: | Shroud for Male Pins |
Connector Style: | Hard Metric, Type AB19 |
Number of Positions: | 95 |
Pitch: | 0.079" (2.00mm) |
Number of Rows: | 5 |
Mounting Type: | Through Hole |
Connector Usage: | Header |
Features: | -- |
Color: | -- |
Note: | Contacts Not Included |
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HM2H67P115LF Application Field and Working Principle
The HM2H67P115LF is a housing for a backplane connector that is used to provide reliable data transmission between adjacent printed circuit boards, especially those in electronic communication and computer systems. It is particularly useful in applications where high speed and high density signal transmission are required. This housing provides a secure connection between the two boards, while also providing thermal, EMI, and vibration protection for the onboard components. It is designed for use in applications like telecommunications, server/storage systems, industrial automation, and consumer electronics.
The HM2H67P115LF is part of a Full-Stack Board-to-Board Connector family that includes two types of connectors, a female connector (HM2H) and a male connector (HM2G). The female connector is also known as the pin header or just the pin connector, and it is used on the side of the printed circuit board to form electrical contact points with the female connector. The male connector is also known as the card edge connector or just the card connector, and it is used on the other side of the printed circuit board to form electrical contact points with the male connector.
The housing of the HM2H67P115LF is composed of two parts, the base and the lid. The base of the housing is generally made of die-cast zinc alloy that has been machined to very precise dimensions. This base has several precisely-sized and spaced holes for fastening the two connectors together in the stack. The lid of the housing is generally made up of injection-molded plastic and houses the contacts and terminals of the connectors.
The connectors of the HM2H67P115LF use a reliable dual-beam shuttle contact system. This system consists of two thin, flexible beams formed in a shuttle shape that make contact with the mating connector. The shuttle contacts are spring-loaded to ensure good contact pressure, even when the connectors have been pulled apart. The contacts are also self-cleaning, helping to minimize over-pressing and prevent insertion forces. This dual-beam shuttle contact system ensures good electrical connection while also providing resistance to vibration and shock.
The HM2H67P115LF’s housing is designed for use in a variety of hostile environments, from hot and humid to extremely cold and dry. The zinc alloy base provides strength and resists corrosion, while the plastic lid provides flexibility and durability. The metal shielding canopies of the system can be configured to provide protection against EMI interference. The connectors of the HM2H67P115LF are UL and CSA approved, and the entire system can meet a variety of industry standard specifications, such as MIL-SPEC and RoHS.
The HM2H67P115LF is a versatile and reliable housing for a backplane connector. The dual-beam shuttle contact system provides good electrical connection between the two boards, while the metal shielding canopies provide high levels of EMI protection. The zinc alloy base and plastic lid provide strength and durability, while the UL and CSA approval ensures safety and quality. The HM2H67P115LF is a suitable solution for a variety of electronic communication and computer systems, especially those requiring high speed and high density signal transmission.
The specific data is subject to PDF, and the above content is for reference
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