HS01

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat Sinks (HS) are metal components used to disperse the heat generated by many different electronics, especially high-power electronic components. Especially in environments at high temperature and with direct heat removal limitations, a Heat sink is necessary to avoid overheating and damage of the electronic component. The HS01 is a new universal thermal interface material (UITM) engineered for high efficiency and reliability in high-performance applications.

The HS01 application field is versatile and covers a wide range of thermal management challenges demanding thermal requirements. It is designed to be used in environments with extreme temperature variances ranging from -55°C to 150°C and performs very well in high current and power environments containing power conversion components, power regulators, as well as motor and small appliance drives. It is designed for efficient heat transfer capabilities that reduce the risk of burnouts and overheating. In particular, HS01 shows great success when used in conjunction with surface-mount devices and metallic components.

The HS01 working principle is based on its construction. It is a metal-based laminar composed of an interspersed layer of copper and a matrix of man-made resin fibers. These elements work in synergy to create a multi-stage cooling system, delivering the highest levels of cooling performance. This novel structure works to efficiently transfer the heat away from the component being cooled and disperse it into the surrounding environment. On account of its superior heat transfer abilities, the HS01 provides a thermally very efficient solution.

What sets the HS01 heat sink apart from other designs is its ability to destroy heat before it has the chance to cause any acceleration in component temperature. As HS01 rapidly draws away the heat, the component’s temperature remains stable even when subjected to high temperature and power stresses. This makes the HS01 an excellent choice for situations which require more heat-resistant solutions.

The HS01 is designed to work across a wide variety of application scenarios, easy to install, and highly versatile. The combination of excellent heat transfer performance, reliable heat absorption, improved thermal dynamics, and increased temperature stability make HS01 an ideal choice for creating heat-resistant solutions. Whether it’s for high-duty-cycle motor drives or surface-mount applications, HS01 is capable of operating in a variety of challenging conditions.

The specific data is subject to PDF, and the above content is for reference