HS02 Allicdata Electronics
Allicdata Part #:

598-1368-ND

Manufacturer Part#:

HS02

Price: $ 19.89
Product Category:

Fans, Thermal Management

Manufacturer: Apex Microtechnology
Short Description: HEATSINK 8P TO-3 4.5C/W
More Detail: Heat Sink TO-3 Aluminum 10.0W @ 50°C Board Level
DataSheet: HS02 datasheetHS02 Datasheet/PDF
Quantity: 428
1 +: $ 18.08100
10 +: $ 17.01500
25 +: $ 15.95160
50 +: $ 14.88820
100 +: $ 14.35640
250 +: $ 13.55890
Stock 428Can Ship Immediately
$ 19.89
Specifications
Series: Apex Precision Power®
Part Status: Active
Type: Board Level
Package Cooled: TO-3
Attachment Method: Bolt On
Shape: Square, Pin Fins
Length: 1.810" (45.97mm)
Width: 1.810" (45.97mm)
Diameter: --
Height Off Base (Height of Fin): 1.500" (38.10mm)
Power Dissipation @ Temperature Rise: 10.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 4.50°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are designed to transfer heat away from electronic components and devices in order to maintain a desired operating temperature. Heat Sinks are commonly used to protect components, and are typically comprised of a metal frame, fins, and a fan for cooling.

The HS02 application field is the protection of temperature-sensitive components from thermal damage caused by prolonged exposure to high temperatures. This can be accomplished by using an HS02 Heat Sink to dissipate the generated heat, allowing the components to remain cool even under extreme conditions. Heat Sinks are designed to be easy to install and remove, making them an ideal solution for applications where component removal or swapping is frequent.

The working principle of the HS02 application is based on a basic thermodynamic idea of heat exchange and transfer. The Heat Sink works by absorbing and dissipating the thermal energy produced by the components, dispersing it into the surrounding environment. This process is known as heat exchange. In order to accomplish this, the Heat Sink acts as a bridge between the component and environment, transferring the heat away from the component into the environment.

This process of heat exchange works by effectively increasing the surface area of contact between the component and the Heat Sink. The fins of the Heat Sink are designed to maximize the surface area available for thermal contact, allowing for maximum heat transfer away from the component. Additionally, a fan is used to further improve cooling efficiency, by driving away hot air from within the Heat Sink enclosure and cooling the Heat Sink itself.

In order to ensure effective cooling, the Heat Sink must be properly maintained. The fan should be regularly inspected and cleaned to ensure that it is operating effectively. Additionally, the fins should be checked periodically for dirt and dust build-up, as this can decrease their thermal efficiency.

The HS02 Heat Sink is a cost-effective and reliable solution for ensuring optimal performance and protection for any temperature-sensitive component or device. With proper maintenance, the HS02 Heat Sink can provide years of reliable and efficient cooling performance.

The specific data is subject to PDF, and the above content is for reference

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