Allicdata Part #: | 1240-1025-ND |
Manufacturer Part#: |
HS28 |
Price: | $ 7.50 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Apex Microtechnology |
Short Description: | HEATSINK SIP |
More Detail: | Heat Sink Aluminum Board Level, Vertical |
DataSheet: | HS28 Datasheet/PDF |
Quantity: | 10 |
1 +: | $ 6.74730 |
10 +: | $ 6.56586 |
25 +: | $ 6.20122 |
50 +: | $ 5.83632 |
100 +: | $ 5.47155 |
250 +: | $ 5.10678 |
500 +: | $ 4.74201 |
1000 +: | $ 4.65081 |
Series: | Apex Precision Power® |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | -- |
Attachment Method: | Bolt On and PC Pin |
Shape: | Rectangular, Fins |
Length: | 2.500" (63.50mm) |
Width: | 1.650" (41.91mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.000" (25.40mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
HS28 is an advanced thermal solution for today’s ever-increasing performance needs. It is a technology that utilizes a combination of modern heat sinks and thermal materials to dissipate heat away from electronic components. HS28 provides an efficient, effective, and reliable way to cool even the most demanding of devices.
Heat sinks are the most common form of thermal management in modern electronics. A heat sink is essentially a large metal or aluminum block that transfers heat from a device into the surrounding environment. Heat sinks are commonly used to cool CPUs, GPUs, and other highly sensitive electronics. Heat sinks are also used to provide an increased surface area within the system to dissipate heat. Heat sinks rely on air or liquid based coolants such as water or air to draw heat away from the component being cooled.
HS28 is designed to provide enhanced cooling while leveraging a very small form factor. It is designed to be highly compatible with standards-based electronic devices and is powered by the latest in thermal technology. It features a multi-layer heat sink design which is optimized for high thermal conductivity. This allows the heat sink to effectively dissipate heat and keep components cool. The heat sinks also feature a durable construction; they are made from durable aluminum or steel which increases their lifespan. The heat sinks come in a variety of sizes and shapes to accommodate different device dimensions.
HS28 is also designed to be highly effective in providing thermal performance. It features advanced thermal materials which help to more efficiently disperse heat away from components. These materials include conductive metal, plastic, and other materials that allow for heat conduction and increased surface area for heat to dissipate. These advanced materials not only make the device more thermally efficient, but they also help to reduce noise levels by absorbing vibration.
In addition, HS28 also provides environmental protection. The components used in the thermal solution are designed to be environmentally friendly. This means that the materials used are non-toxic and are produced without emissions of harmful chemicals and pollutants. The materials are also designed to be flame retardant and are capable of withstanding extreme temperatures.
HS28 is a great choice for anyone looking for an efficient and reliable thermal solution. It offers a wide range of capabilities and features that make it a great choice for almost any environment. Whether you are looking for a solution for cooling components in a small form factor or need a powerful solution for keeping components cool in a highly sensitive environment, HS28 is an excellent choice. Its components are designed to last and provide an efficient and reliable thermal solution.
So, if you are looking for highly reliable and efficient thermal solutions, the HS28 line of thermal solutions is an excellent choice. Its compact design and advanced materials make it an ideal choice for cooling components in a wide range of environments. With its advanced heat sink and thermal materials, it offers an efficient and reliable thermal solution that can even handle the most demanding of devices.
The specific data is subject to PDF, and the above content is for reference
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