HS28 Allicdata Electronics
Allicdata Part #:

1240-1025-ND

Manufacturer Part#:

HS28

Price: $ 7.50
Product Category:

Fans, Thermal Management

Manufacturer: Apex Microtechnology
Short Description: HEATSINK SIP
More Detail: Heat Sink Aluminum Board Level, Vertical
DataSheet: HS28 datasheetHS28 Datasheet/PDF
Quantity: 10
1 +: $ 6.74730
10 +: $ 6.56586
25 +: $ 6.20122
50 +: $ 5.83632
100 +: $ 5.47155
250 +: $ 5.10678
500 +: $ 4.74201
1000 +: $ 4.65081
Stock 10Can Ship Immediately
$ 7.5
Specifications
Series: Apex Precision Power®
Part Status: Active
Type: Board Level, Vertical
Package Cooled: --
Attachment Method: Bolt On and PC Pin
Shape: Rectangular, Fins
Length: 2.500" (63.50mm)
Width: 1.650" (41.91mm)
Diameter: --
Height Off Base (Height of Fin): 1.000" (25.40mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

HS28 is an advanced thermal solution for today’s ever-increasing performance needs. It is a technology that utilizes a combination of modern heat sinks and thermal materials to dissipate heat away from electronic components. HS28 provides an efficient, effective, and reliable way to cool even the most demanding of devices.

Heat sinks are the most common form of thermal management in modern electronics. A heat sink is essentially a large metal or aluminum block that transfers heat from a device into the surrounding environment. Heat sinks are commonly used to cool CPUs, GPUs, and other highly sensitive electronics. Heat sinks are also used to provide an increased surface area within the system to dissipate heat. Heat sinks rely on air or liquid based coolants such as water or air to draw heat away from the component being cooled.

HS28 is designed to provide enhanced cooling while leveraging a very small form factor. It is designed to be highly compatible with standards-based electronic devices and is powered by the latest in thermal technology. It features a multi-layer heat sink design which is optimized for high thermal conductivity. This allows the heat sink to effectively dissipate heat and keep components cool. The heat sinks also feature a durable construction; they are made from durable aluminum or steel which increases their lifespan. The heat sinks come in a variety of sizes and shapes to accommodate different device dimensions.

HS28 is also designed to be highly effective in providing thermal performance. It features advanced thermal materials which help to more efficiently disperse heat away from components. These materials include conductive metal, plastic, and other materials that allow for heat conduction and increased surface area for heat to dissipate. These advanced materials not only make the device more thermally efficient, but they also help to reduce noise levels by absorbing vibration.

In addition, HS28 also provides environmental protection. The components used in the thermal solution are designed to be environmentally friendly. This means that the materials used are non-toxic and are produced without emissions of harmful chemicals and pollutants. The materials are also designed to be flame retardant and are capable of withstanding extreme temperatures.

HS28 is a great choice for anyone looking for an efficient and reliable thermal solution. It offers a wide range of capabilities and features that make it a great choice for almost any environment. Whether you are looking for a solution for cooling components in a small form factor or need a powerful solution for keeping components cool in a highly sensitive environment, HS28 is an excellent choice. Its components are designed to last and provide an efficient and reliable thermal solution.

So, if you are looking for highly reliable and efficient thermal solutions, the HS28 line of thermal solutions is an excellent choice. Its compact design and advanced materials make it an ideal choice for cooling components in a wide range of environments. With its advanced heat sink and thermal materials, it offers an efficient and reliable thermal solution that can even handle the most demanding of devices.

The specific data is subject to PDF, and the above content is for reference

Related Products
Search Part number : "HS28" Included word is 14
Part Number Manufacturer Price Quantity Description
HS28RC(72) Hirose Elect... 7.67 $ 6 CONN CAP SIZE 28 METAL CH...
HS2800810000G Amphenol Any... 3.48 $ 1000 500 TB SP CL INTERLACE/T7...
HS2830810000G Amphenol Any... 3.48 $ 1000 508 TB SP CL INTERLACE/T7...
HS2800800000G Amphenol Any... 3.55 $ 1000 500 TB SP CLA PARALLEL/T7...
HS2830800000G Amphenol Any... 3.55 $ 1000 508 TB SP CLA PARALLEL/T7...
HS2820810000G Amphenol Any... 4.21 $ 1000 1000 TB SP CL INTERLACE7 ...
HS2840810000G Amphenol Any... 4.21 $ 1000 1016 TB SP CL INTERLACE7 ...
HS2850800000G Amphenol Any... 4.23 $ 1000 762 TB SP CLA PARALLEL/T7...
HS2810800000G Amphenol Any... 4.24 $ 1000 750 TB SP CLA PARALLEL/T7...
HS2820800000G Amphenol Any... 4.27 $ 1000 1000 TB SP CL PARALLEL/T7...
HS2840800000G Amphenol Any... 4.27 $ 1000 1016 TB SP CL PARALLEL/T7...
HS2810810000G Amphenol Any... 4.17 $ 1000 750 TB SP CL INTERLACE/T7...
HS2850810000G Amphenol Any... 4.17 $ 1000 762 TB SP CL INTERLACE/T7...
HS28 Apex Microte... 7.5 $ 10 HEATSINK SIPHeat Sink Al...
Latest Products
VHS-45

HEATSINK HALF BRICK ALUM BLACKHeat Sink ...

VHS-45 Allicdata Electronics
MHST15055

HEATSINK 2.36L X1.4"H EXTRUSIONHeat Sink...

MHST15055 Allicdata Electronics
MHST10055

HEATSINK 2.36L X.94"H EXTRUSIONHeat Sink...

MHST10055 Allicdata Electronics
PH3-300-300-0.21-1A

IR HEAT SPREADER/EMITTER W/ADHHeat Sink ...

PH3-300-300-0.21-1A Allicdata Electronics
132-11B9

HEATSINK EXTRUDEDHeat Sink

132-11B9 Allicdata Electronics
413F

HEATSINK POWER TO-3Heat Sink

413F Allicdata Electronics