HS32 Allicdata Electronics
Allicdata Part #:

1240-1027-ND

Manufacturer Part#:

HS32

Price: $ 30.16
Product Category:

Fans, Thermal Management

Manufacturer: Apex Microtechnology
Short Description: HEATSINK SIP 1.33C/W
More Detail: Heat Sink SIP Aluminum Board Level, Vertical
DataSheet: HS32 datasheetHS32 Datasheet/PDF
Quantity: 7
1 +: $ 27.41760
10 +: $ 25.80480
25 +: $ 24.19200
50 +: $ 22.57920
100 +: $ 21.77280
250 +: $ 20.56320
Stock 7Can Ship Immediately
$ 30.16
Specifications
Series: Apex Precision Power®
Part Status: Active
Type: Board Level, Vertical
Package Cooled: SIP
Attachment Method: Clip
Shape: Rectangular, Fins
Length: 6.000" (152.40mm)
Width: 2.953" (75.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.338" (34.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 1.33°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important aspect of many types of industrial systems. Heat sinks are a vital part of thermal management and provide effective cooling in various applications. The HS32 model of heat sink is a finned heat sink that is capable of dissipating large amounts of heat. It is a popular choice for a variety of system cooling applications and is a low-cost solution for a wide range of applications.

Description of HS32

The HS32 is an aluminum heat sink designed to dissipate heat from electronic components. It is designed with a series of fins that help to increase surface area and improve heat dissipation. It is capable of dissipating more than 10W of power. The HS32 is a popular choice among thermal engineers due to its low cost and efficient cooling performance. The heat sink features an anodized aluminum finish to ensure durability and is corrosion resistant.

HS32 Application Fields

The HS32 heat sink is designed for a variety of system cooling applications. It is an ideal choice for cooling applications that require high thermal capacity and low noise. It is commonly used in electronics, LED lighting, automotive, software, server, and many other applications. It is also often used in military, aerospace, medical, and industrial applications. Due to its efficient cooling capabilities, it is often used to cool components with high heat usage, such as CPUs, GPUs, capacitors, and transistors.

HS32 Working Principle

The HS32 heat sink uses the principles of conduction and convection to dissipate heat. Heat generated by the components is first transferred to the heat sink through the process of conduction. By making contact with the heat sink, the heat is then dissipated into the atmosphere through the process of convection. The fins on the HS32 increase its surface area and help to increase the rate of heat dissipation. The aluminum finish of the HS32 is also designed to create an air gap between the component and the heat sink to further aid in the dissipation of heat.

Conclusion

The HS32 is a versatile and popular heat sink model due to its low-cost and efficient cooling performance. It is designed for a variety of cooling applications and is capable of dissipating more than 10W of power. It uses a combination of conduction and convection to dissipate heat from components to provide an effective cooling solution. The HS32 is an ideal choice for any application that requires efficient and reliable thermal management.

The specific data is subject to PDF, and the above content is for reference

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