
Allicdata Part #: | IR3473MTRPBFTR-ND |
Manufacturer Part#: |
IR3473MTRPBF |
Price: | $ 16.80 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Infineon Technologies |
Short Description: | IC REG BUCK ADJ 6A SYNC PQFNBuck Switching Regulat... |
More Detail: | N/A |
DataSheet: | ![]() |
Quantity: | 7950 |
1 +: | $ 16.78000 |
10 +: | $ 16.27660 |
100 +: | $ 15.94100 |
1000 +: | $ 15.60540 |
10000 +: | $ 15.10200 |
Series: | SupIRBuck® |
Packaging: | Tape & Reel (TR) |
Part Status: | Active |
Function: | Step-Down |
Output Configuration: | Positive |
Topology: | Buck |
Output Type: | Adjustable |
Number of Outputs: | 1 |
Voltage - Input (Min): | 3V |
Voltage - Input (Max): | 27V |
Voltage - Output (Min/Fixed): | 0.5V |
Voltage - Output (Max): | 12V |
Current - Output: | 6A |
Frequency - Switching: | Up to 750kHz |
Synchronous Rectifier: | Yes |
Operating Temperature: | -40°C ~ 125°C (TJ) |
Mounting Type: | Surface Mount |
Package / Case: | 16-PowerVQFN |
Supplier Device Package: | 16-QFN (4x5) |
Base Part Number: | IR3873MPBF |
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Full model: IR3473MTRPBF
Manufacturer: Infineon Technologies
Device type: Synchronous buck PWM controller (multi-phase VRM)
Package: QFN-40 (6mm×6mm)
Operating voltage: 4.5V ~ 21V (input)
Output voltage: 0.6V ~ 5.5V (programmable)
Operating temperature: -40°C ~ +125°C (industrial grade)
Switching frequency: 200kHz ~ 1.5MHz (programmable)
Control architecture: current mode control
Phase support: 2/3/4 phases configurable
Reference voltage accuracy: ±0.5%
Drive capability: 4A peak (high and low side drive)
Protection function: overvoltage/undervoltage/overcurrent/overtemperature
DESCRIPTION
The IR3473MTRPBF SupIRBuckTM is an easy‐to‐use, fully integrated and highly efficient DC/DC voltage regulator. The onboard constant on time hysteretic controller and MOSFETs make IR3473MTRPBF a space‐efficient solution that delivers up to 6A of precisely controlled output voltage. Programmable switching frequency, soft start, and thermally compensated over current protection allows for a very flexible solution suitable for many different applications and an ideal choice for battery powered applications. Additional features include pre‐bias startup, very precise 0.5V reference, under/over voltage shutdown, thermal protection, power good output, and enable input with voltage monitoring capability.
FEATURES
1. Input Voltage Range: 3V to 27V
2. Output Voltage Range: 0.5V to 12V
3. Continuous 6A Load Capability
4. Constant On‐Time Control
5. Compensation Loop not Required
6. Excellent Efficiency at Very Low Output Currents
7. Programmable Switching Frequency and Soft Start
8. Thermally Compensated Over Current Protection
9. Power Good Output
10. Precision Voltage Reference (0.5V, +/‐1%)
11. Enable Input with Voltage Monitoring Capability
12. Pre‐bias Start Up
13. Thermal Shut Down
14. Under/Over Voltage Fault Protection
15. Forced Continuous Conduction Mode Option
16. Very Small, Low Profile 4mm x 5mm QFN Package
APPLICATIONS
1. Notebook and Desktop Computers
2. Consumer Electronics – STB, LCD, TV, Printers
3. 12V and 24V Distributed Power Systems
4. General Purpose POL DC‐DC Converters
5. Game Consoles and Graphics Cards
Pin definition (QFN-40 key pins)
Pin number | Name | Function |
1-4 | PWM1-4 | Multi-phase PWM output |
5 | VCC | 5V bias power supply |
6 | BOOT | Bootstrap capacitor |
7 | COMP | Compensation network |
8 | FB | Voltage feedback |
9 | VSEN | Remote voltage sense + |
10 | GND | Signal ground |
11 | ISEN | Current sense |
12 | PMBUS_CLK | PMBus clock |
13 | PMBUS_DATA | PMBus data |
14-17 | PHASE1-4 | Phase node monitoring |
18-40 | Other power/control pins |
Typical application circuit
4-phase 12V→1.2V@100A design:
- Input capacitor: 4×47μF ceramic (25V)
- Each phase:
* Inductor: 0.22μH (IRFH6200)
* MOSFET: IRFH8314 (high side) + IRFH8316 (low side)
- Output capacitor: 8×22μF ceramic (X7R)
- PMBus configuration resistor: 10kΩ pull-up
Design considerations
1. Layout key points:
- SW node area per phase <25mm²
- Current sensing traces require Kelvin connection
- Compensation network is far away from high-frequency noise sources
2. Thermal management:
- The heat dissipation pad at the bottom of the chip needs 4×0.3mm vias to connect to the inner ground plane
- It is recommended to use 2oz copper thick PCB
The specific data is subject to PDF, and the above content is for reference
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