IS25CQ032-JBLE-TR Allicdata Electronics
Allicdata Part #:

IS25CQ032-JBLE-TR-ND

Manufacturer Part#:

IS25CQ032-JBLE-TR

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: ISSI, Integrated Silicon Solution Inc
Short Description: IC FLASH 32M SPI 104MHZ 8SOIC
More Detail: FLASH Memory IC 32Mb (4M x 8) SPI 104MHz 8-SOIC
DataSheet: IS25CQ032-JBLE-TR datasheetIS25CQ032-JBLE-TR Datasheet/PDF
Quantity: 27
Stock 27Can Ship Immediately
Specifications
Series: --
Packaging: Tape & Reel (TR) 
Part Status: Active
Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH
Memory Size: 32Mb (4M x 8)
Clock Frequency: 104MHz
Write Cycle Time - Word, Page: 4ms
Memory Interface: SPI
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Supplier Device Package: 8-SOIC
Description

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The IS25CQ032-JBLE-TR belongs to the family of non-volatile memory designs from ISSI (Integrated Silicon Solution Inc.). It is a 32 Mbit Silicon-Oxide-Nitride-Oxide-Silicon (SONOS) Flash memory technology with a page size of 512 bytes. Its small package size, short access times and low power consumption endow it with great usability in a number of applications. This article will discuss the IS25CQ032-JBLE-TR application field and its working principle.

The memory device of IS25CQ032-JBLE-TR is suitable for use in a wide range of applications. It is used in automotive and industrial applications due to its compatibility with most major auto makers, 3G/4G telecommunications and medical instrumentation. This device is ideal for the rapid development of solutions in those environments. Moreover, this memory device enables high-performance embedded systems for gaming and consumer electronics. Due to its high-end performance, the IS25CQ032-JBLE-TR is specifically designed for consumer electronics.

The IS25CQ032-JBLE-TR comprises of three parts that work together in order to make sure that data is safely stored in the memory. These components are the silicon-oxide-nitride-oxide-silicon (SONOS) transistors, the metal-oxide-semiconductor (MOS) structure, and the embedded silicon-oxide-NFET (NFET) device. All of these components make the IS25CQ032-JBLE-TR a reliable and powerful memory device.

The SONOS transistors are the core of the IS25CQ032-JBLE-TR. They are responsible for storing data in non-volatile memory cells. A single SONOS transistor has two layers, the silicon-oxide-nitride (SiON) and the silicon-oxide-nitride-oxide-silicon (SONOS) layer. When a voltage is applied to the transistor, the SiON layer increases access time and also lowers power consumption. On the other hand, the SONOS layer protects the device from electric fields, which strongly increases the memory endurance.

The MOS structure is responsible for controlling the electric fields in the memory device. It consists of two back-to-back metal-oxide-semiconductor field effect transistors (MOSFETs). One MOSFET is responsible for augmenting the electric field, while the other MOSFET is responsible for clearing the electric field. Together they enable the operation of the IS25CQ032-JBLE-TR.

Finally, the NFET device provides protection between the memory cells and the electric field. This makes sure that the stored data is not affected by any external interference, while reducing the power consumption. This device also performs a number of other functions, such as thermal management and protecting the gate oxide layer.

The IS25CQ032-JBLE-TR memory device is a powerful and reliable design from ISSI. Its small package size, fast access times, and low power consumption make it ideal for automotive and industrial applications, as well as consumer electronics. Further, its three components, the SONOS transistors, the MOS structure, and the embedded NFET device, working together enable a reliable and secure memory device.

The specific data is subject to PDF, and the above content is for reference

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