IT3M-300S-BGA(57)

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Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) frameworks are an integral part of the modern electronics industry. They are capable of providing a wide range of features and high performance for all of the necessary components. The IT3M-300S-BGA(57) connector is one of the cost-effective and reliable solutions for board to board connections in servers, switches and a variety of other electronic applications.

The IT3M-300S-BGA(57) connector is designed for high speed, low power, low cost interfacing between two multi layer boards. It features gold plating on all of its contacts for maximum corrosion protection, and the board edge is radially designed so that it can seat securely into the board and maintain a consistent contact over time. The connector is composed of four slots wherein each slot has 57-pins, located in a 3x3 array with three slots on each side of the board.

The IT3M-300S-BGA(57) connector is designed to provide high-speed signaling with a variety of data rates. The connector is capable of supporting Gigabit Ethernet rates up to 2.5 Gbps, along with PCIe 2.0 and SATA 2.0 topologies. Additionally, the connector has differential pairs to reduce crosstalk and signal noise, and an intelligent signal conditioning circuit to further enhance signal integrity.

The IT3M-300S-BGA(57) connector is well suited for interconnecting boards such as servers, switches, data centers, network cards, and more. It is also commonly used in wireless networking and point-to-point signal transmission systems. Due to its highly reliable connection characteristics, the IT3M-300S-BGA(57) connector is a cost effective and easy to install solution for high speed board-to-board connections.

The working principle of the IT3M-300S-BGA(57) connector is straightforward. It relies on a spring based contact system, which allows the pins of the connector to flex down on the contact pad, making electrical connection between the two boards. The force of the spring is adjustable, allowing the IT3M-300S-BGA(57) to be tailored to the application. The IT3M-300S-BGA(57) also takes into account the additional force when the connector is pushed and twisted in different directions, ensuring that its connection is highly reliable and secure.

In conclusion, the IT3M-300S-BGA(57) connector is a reliable and cost efficient solution for multi-layer board connections. It offers high speed signal transfer and a variety of data rates, along with specialized signal conditioning circuits for improved signal integrity. Its spring contact system ensures that the connection between the two boards will remain secure and reliable over time. The IT3M-300S-BGA(57) is a great solution for servers, switches, and data centers, as well as a variety of other applications.

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