IT3M-300S-BGA(37)

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The IT3M-300S-BGA (37) is an innovative connection solution that is designed to provide superior electrical connectivity between two boards. It is a product that is ideal for a wide range of applications, such as low-power digital interconnects and high-speed datacom, computing, and networking systems. It is also suitable for applications requiring reliable and speedy ribbon or discrete signal connections, including embedded systems and digital signal connections.

This product uses an innovative “edge type” connection system which is a combination of several different kinds of contacts: beam, finger, pin, jumper, and wafer. It also includes an array of pins in a 37-way configuration, allowing for a wide range of design possibilities. This allows the user to create highly customised solutions for a variety of applications. Additionally, the product is designed to be resistant to shock, vibration, and heat, making it suitable for well as industrial-grade applications.

The IT3M-300S-BGA (37) offers an outstanding level of flexibility that allows users to create customised assemblies for their applications. This is done by selecting the appropriate number of contact inserts to suit their individual needs. Each insert contains the necessary precision contacts, gold plating, and insulation material for a reliable and efficient electrical connection. The product also includes precision connectors and terminals that allow for precision connections between the two boards. This ensures that all signals and data can be accurately transferred.

The IT3M-300S-BGA (37)also includes a high-speed differential-signal path that ensures that data rates remain consistent and that signals are transferred without distortion or noise. Additionally, the product is designed to meet rigorous mechanical, electrical, and environmental requirements. This allows for a reliable and long-lasting connection between two boards. The product is also designed to provide a high level of noise immunity, ensuring that outside interference does not affect the data transfer rate.

The IT3M-300S-BGA (37) is an ideal solution for a wide variety of applications in a variety of industries. It is designed to provide a reliable, robust, and high performance connection between two boards. Its innovative edge-type connection system and array of contacts provide unparalleled flexibility and a reliable signal path. Additionally, its high-speed differential-signal path and noise immunity guarantee that data rates remain consistent and that signals are transferred without distortion or noise. This makes it an ideal choice for low-power digital interconnects, high-speed datacom, computing, and networking systems.

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