LAT0127B3CB Allicdata Electronics
Allicdata Part #:

294-1113-ND

Manufacturer Part#:

LAT0127B3CB

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK PWR .75"H BLACK TO-220
More Detail: Heat Sink TO-127, TO-220 Aluminum Board Level
DataSheet: LAT0127B3CB datasheetLAT0127B3CB Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: LA-B3
Part Status: Obsolete
Type: Board Level
Package Cooled: TO-127, TO-220
Attachment Method: Bolt On
Shape: Rhombus
Length: 1.630" (41.40mm)
Width: 1.290" (32.77mm)
Diameter: --
Height Off Base (Height of Fin): 0.750" (19.05mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 12.90°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-heat sinks are devices that remove heat from electronic components and dissipate it into the environment. The LAT0127B3CB is an example of a thermal-heat sink designed to efficiently dissipate heat from integrated circuit packages in computers, telecommunications equipment, and other devices.

The LAT0127B3CB is composed of a base plate, a tapered block of aluminum, pins, and fins. The base plate is generally plate steel, copper, or aluminum for proper electrical conductivity. Tthe aluminum block is designed to dissipate the heat received from the IC package. The pins and fins act as channels for airflow, and maximize the heat transfer and dissipation potential of the device.

The working principle of the LAT0127B3CB is simple and straightforward: Heat is transferred from the IC package to the aluminum block, where the heat is dissipated by convective, conductive, and radiative heat transfer processes. The heat distributed on the surface of the aluminum block is then dissipated into the surrounding environment by means of forced-air cooling or natural air convection.

The application field of the LAT0127B3CB is large and varied, and includes applications where high temperatures of the components are a problem. This includes consumer electronics such as computers, communications equipment, and gaming consoles. Additionally, it is often found in industrial and military applications, where high temperatures are a significant concern. The LAT0127B3CB is capable of dissipating large amounts of heat, ensuring that temperature levels remain within the desired range at all times.

In summary, the LAT0127B3CB is a thermal-heat sink device designed to effectively and efficiently dissipate heat from integrated circuit packages in a variety of consumer, industrial, and military applications. Its working principle is based on the process of transferring heat from the package to an aluminum block, and then dissipating it into the surrounding environment with the use of forced-air cooling or natural air convection. The LAT0127B3CB is an invaluable asset in ensuring safe and secure operation of electrical components.

The specific data is subject to PDF, and the above content is for reference

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