| Allicdata Part #: | LB66B1B-ND |
| Manufacturer Part#: |
LB66B1B |
| Price: | $ 0.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CTS Thermal Management Products |
| Short Description: | HEATSINK PWR .50"H BLACK TO-3 |
| More Detail: | Heat Sink TO-66 Aluminum Board Level |
| DataSheet: |  LB66B1B Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | 0.00000 |
| Series: | -- |
| Part Status: | Obsolete |
| Type: | Board Level |
| Package Cooled: | TO-66 |
| Attachment Method: | Bolt On |
| Shape: | Rhombus |
| Length: | 1.321" (33.56mm) |
| Width: | 1.120" (28.45mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 17.10°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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LB66B1B is favorite among thermal-heat sinks because of its ability to effectively and efficiently transfer heat away from electronics, thereby preventing device failure. This article will discuss the application field and working principles of this device.
Applications of LB66B1B
The LB66B1B heat sink can be used in many different applications, from consumer electronics to telecommunications. It is commonly used in personal computers, networking and communications equipment, high performance gaming PC’s, and servers. It is also used in industrial applications, such as automotive electronics, cooling systems, and medical devices. Additionally, the LB66B1B heat sink can be used in commercial and residential HVAC systems, in data centers and laboratories, and in military applications.
Working Principles of LB66B1B
The LB66B1B heat sink is designed to dissipate heat away from critical electronic components. It does this by employing an effective combination of aluminum fins and a heat pipe that circulates heat-carrying refrigerant to increase cooling efficiency and reduce system temperature. The combination of aluminum fins and the heat pipe allows the unit to dissipate heat quickly and efficiently without any additional power requirements.
The aluminum fins of the LB66B1B heat sink are arranged in a unique and efficient pattern that maximizes heat dissipation. The fins are designed with serrated edges to increase surface area for heat transfer. The fins also provide increased air flow to help keep critical components cool. The heat pipe component of this device transfers heat away from its source through conduction. The refrigerant in the heat pipe then circulates back to the source, where it absorbs more heat and carries it away from the components.
Installation of LB66B1B Heat Sinks
The LB66B1B heat sink is designed for easy installation. When installing, it is important to make sure that all components are properly aligned in order to maximize heat transfer. The heat pipe, fan, and aluminum fins must all be oriented in the correct direction. The heat pipe should be oriented perpendicular to the source, while the fan should be facing outwards. Once the components are aligned, the LB66B1B can be secured to the application with screws.
The Benefits of LB66B1B Heat Sinks
The LB66B1B heat sink is an ideal choice for thermal-heat sinks because of its ability to effectively and efficiently transfer heat away from electronics. This prevents device failure and increases the life of the components. Additionally, the LB66B1B is easy to install and does not require any additional power requirements. As such, it is cost-effective and a great choice for applications that require reliable and efficient thermal management.
The specific data is subject to PDF, and the above content is for reference
| Part Number | Manufacturer | Price | Quantity | Description |
|---|
| LB66B1B | CTS Thermal ... | 0.0 $ | 1000 | HEATSINK PWR .50"H BLACK ... |