Allicdata Part #: | LCMXO2280E-4FT324I-ND |
Manufacturer Part#: |
LCMXO2280E-4FT324I |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Lattice Semiconductor Corporation |
Short Description: | IC FPGA 271 I/O 324FTBGA |
More Detail: | N/A |
DataSheet: | LCMXO2280E-4FT324I Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | MachXO |
Part Status: | Obsolete |
Number of LABs/CLBs: | 285 |
Number of Logic Elements/Cells: | 2280 |
Total RAM Bits: | 28262 |
Number of I/O: | 271 |
Voltage - Supply: | 1.14 V ~ 1.26 V |
Mounting Type: | Surface Mount |
Operating Temperature: | -40°C ~ 100°C (TJ) |
Package / Case: | 324-LBGA |
Supplier Device Package: | 324-FTBGA (19x19) |
Base Part Number: | LCMXO2280 |
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Field Programmable Gate Array (FPGAs) are an essential component of modern embedded systems, used in a broad range of products and applications. The LCMXO2280E-4FT324I is one of a range of FPGA devices from Lattice Semiconductor, offering performance, flexibility, scalability and power efficiency. This article examines the device’s main features, and outlines its application fields and working principles.
The LCMXO2280E-4FT324I is based on the MachXO2™ FPGA fabric from Lattice. It is available in a 324-pin Pb-free (RoHS compliant) BGA package, and can be used with a 3.3V and 1.8V supply. It is designed to be easy to use, with flexible programming options and a 4-wire JTAG programming interface. The FPGA features 1.8V logic levels, with 12KB of internal SRAM and 16 user I/O pins, as well as 25 I/O keys.
The LCMXO2280E-4FT324I is ideal for applications such as motor control, communication systems and embedded controllers. It is compatible with industry standard buses such as I2C and SPI, as well as other higher-level standards such as USB and Ethernet. The device’s low power consumption makes it suitable for battery-powered applications, such as mobile phones, portable medical instruments and mobile robots.
At the heart of the LCMXO2280E-4FT324I is its FPGA fabric. This consists of a large number of logic elements, interconnected by an on-chip programmable interconnect. FPGA logic elements can be programmed to perform a variety of operations, making them highly flexible and reconfigurable devices. An FPGA can be programmed either through hardware (HDL) or software (high-level languages).
The LCMXO2280E-4FT324I’s FPGA fabric can be configured to implement custom logic designs. This is achieved with the LatticeECP IP Core Development Kit (IPC-DK) software, which makes it easy to design and implement custom circuits. The IPC-DK supports VHDL, Verilog, System verilog and SystemC software, allowing designers to take advantage of the latest programming tools.
In addition to custom logic designs, the LCMXO2280E-4FT324I can also be used for signal processing and signal routing applications. Its embedded FPGA fabric supports signal processing algorithms such as FIR and IIR filters, audio conversion, and data streaming. It can also be used in combination with external memory chips and on-chip peripherals to carry out complex signal routing tasks.
Finally, the LCMXO2280E-4FT324I can be used for the integration of digital and analog functions. Its embedded analog-to-digital converter and digital-to-analog converter can be used for the conversion of analog signals to digital format, as well as for the generation of complex waveforms. The device also features integrated PLLs for low-jitter timing applications, and an array of programmable I/O pins to facilitate integration with external circuits.
The LCMXO2280E-4FT324I is a powerful, low-cost and easy to use FPGA device, suitable for a wide range of embedded applications. Its embedded FPGA fabric can be configured for custom logic designs, signal processing and signal routing applications, as well as for the integration of digital and analog functions. The device’s low power consumption make it suitable for battery-powered applications, and its compatibility with industry standard buses ensures interoperability with a broad range of external peripherals and memory chips.
The specific data is subject to PDF, and the above content is for reference
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