LCMXO2280E-5FTN324C

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Embedded system architectures have grown exponentially in complexity over the past few decades as more sophisticated capabilities are integrated into smaller, more efficient systems. In order to keep up with this growth, there is an increased demand for Field Programmable Gate Arrays (FPGAs) in embedded systems. FPGAs enable designers to create highly sophisticated designs that can enable a wide range of features, such as dedicated high-speed I/O, video processing and encryption, in a variety of form factors. The LCMXO2280E-5FTN324C is one such FPGA that can be used in embedded applications.

The LCMXO2280E-5FTN324C is an Enhanced Spartan-6 FPGA from Lattice Semiconductor. This part offers a range of features that make it ideal for use in embedded applications. It has a low-power consumption of up to 1.5 W, making it suitable for battery-powered applications. It also provides a wide operating temperature range, from -40 °C to +125 °C. This makes it suitable for embedded systems that will be operating in extreme environments.

The FPGA architecture offers high levels of configurability and flexibility. The LCMXO2280E-5FTN324C features more than 140K logic elements, 288 90-pin configurable I/Os, 8 phase-lock loops (PLLs), 8 LEs (look-up tables), and 4 5-pin memory blocks. It also offers enhanced clock frequency performance, with clock frequencies up to 550 MHz. All of these features make it highly suited for use in a wide range of embedded applications.

The LCMXO2280E-5FTN324C also offers advanced security features, such as encryption, secure boot and key storage. This makes it ideal for use in applications that require secure communications and data storage solutions. It also supports software development through multiple embedded development platforms, such as MicroBlaze, ProASIC3 and ECP. This allows for rapid development and integration of the FPGA into a wide range of applications.

In addition to its excellent performance, the LCMXO2280E-5FTN324C also offers a wide range of packaging options. It is available in a variety of package types, including BGA (Ball Grid Array), QFN (Quad Flat No-lead), MLF (MicroLeadFrame), and PQFP (Plastic Quad-Flat Package). This allows designers to select the optimal packaging option for their application, while minimizing the BOM (bill of materials) cost.

The LCMXO2280E-5FTN324C is a powerful and versatile embedded FPGA that can enable the next generation of highly sophisticated embedded systems. It offers a wide range of features and performance characteristics that make it suitable for a variety of applications. With its variety of packaging options, it is also cost effective and easy to integrate into any embedded design.

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