LCMXO3LF-2100C-5BG256C

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Embedded devices have become a part of everyday life, from computers to smartphones, tablets and wearables. As computing power and digital capabilities have increased, so have the number of applications requiring embedded solutions. In order to keep up with the ever-changing demand, the development of Field Programmable Gate Arrays (FPGAs) has exploded.

FPGAs are programmable integrated circuits which can be used to create specific designs or complex systems, tasks or functions which meet the needs of a wide variety of applications. As FPGAs are programmable, they offer flexibility, enabling the end user to customize the device in terms of functionality, speed and cost.

In the embedded field, FPGAs have been gaining a lot of traction, providing designers and engineers with the ability to create devices that can meet the challenging requirements of the embedded world. These devices can be manufactured with a variety of technology nodes, from 90 to 40nm, with feature sizes shrinking in proportion.

Lattice Semiconductor, one of the largest suppliers of embedded FPGAs, recently released the latest Lattice FPGA, the Lattice LCMXO3LF-2100C-5BG256C, which combines multiple embedded cores in one device.

The LCMXO3LF provides designers with the flexibility of a programmable device while offering the highest system-level integration of its class. The 2,100 programmable logic cells enable integration of up to three ARM® Cortex-A5 processor cores, one ARM Cortex-M0 processor core, a DDR2/DDR3 controller, a PCI Express controller, a High-Speed SerDes, SRAM and flash memories, as well as peripherals, including Ethernet/USB/CAN/PTP. The device also provides design engineers with a comprehensive range of software and tools to help reduce their development time.

The FPGA’s memory is organized as a 256Mbit configuration, enabling configuration of up to 256 cores. It supports up to 1.8 million maximum logic elements and 872 user I/O pins. In addition, the device includes two live-at-power-on (LAP) memory blocks for easy configuration, and supports various single-ended and differential I/O standards.

A range of industrial environmental and system requirements can be addressed by the LCMXO3LF, including temperature grades of 0°C to 85°C, as well as commercial and industrial grades of -40°C to 85°C. The device meets the requirements of industrial applications in terms of shock (up to 1000G) and vibration (up to 20G).

Targeting embedded applications and mobile platforms, the LCMXO3LF is designed to run under low power and low noise conditions. Its power consumption is minimized due to its low-power architecture, while power shut-off mode helps conserve additional power.

The LCMXO3LF FPGA provides designers with a robust, low-power solution for embedded applications. Its low-power, small form factor and flexible range of I/O standards make it an ideal choice for embedded designs. Its highly integrated capabilities make it suitable for applications in the industrial, medical, automotive and consumer markets.

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