LCMXO3LF-2100C-5BG256I Allicdata Electronics
Allicdata Part #:

220-2005-ND

Manufacturer Part#:

LCMXO3LF-2100C-5BG256I

Price: $ 7.33
Product Category:

Integrated Circuits (ICs)

Manufacturer: Lattice Semiconductor Corporation
Short Description: IC FPGA 206 I/O 256CABGA
More Detail: N/A
DataSheet: LCMXO3LF-2100C-5BG256I datasheetLCMXO3LF-2100C-5BG256I Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 3 (168 Hours)
1 +: $ 7.33000
10 +: $ 7.11010
100 +: $ 6.96350
1000 +: $ 6.81690
10000 +: $ 6.59700
Stock 1000Can Ship Immediately
$ 7.33
Specifications
Series: MachXO3
Part Status: Active
Lead Free Status / RoHS Status: --
Number of LABs/CLBs: 264
Moisture Sensitivity Level (MSL): --
Number of Logic Elements/Cells: 2112
Total RAM Bits: 75776
Number of I/O: 206
Voltage - Supply: 2.375 V ~ 3.465 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LFBGA
Supplier Device Package: 256-CABGA (14x14)
Description

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Field Programmable Gate Array (FPGA) is a type of integrated circuit technology which can be programmed by the user to take on different physical structures or configurations. An FPGA consists of configurable logic blocks (CLB) surrounded by dedicated programmable interconnects that can be reconfigured to customize the FPGA to fit a specific application. FPGAs are used in a variety of applications such as communications, networking, military/aerospace, medical, automotive, industrial automation, and consumer electronics.

The LCMXO3LF-2100C-5BG256I is a Field Programmable Gate Array (FPGA) developed by Lattice Semiconductor Corporation. This device family is well-suited for low-cost, low-power embedded applications, particularly those needing to comply with EAN/RoHS requirements. This family of FPGAs is fabricated using the company\'s 0.7 μm radiation-hardened (RD) CMOS process.

The LCMXO3LF-2100C-5BG256I consists of a two-gate array (TGA) embedded in an FPGA fabric that provides as many as 5,608 logic cells, 256 kbits internal RAM, dual-ported blocks for low-power SRAM emulation, and up to 44 user-defined I/O pins. The TGA on the device allows for early validation of embedded designs, so that the FPGA can be populated and power balanced faster. The internal RAM architecture consists of four separate RAM blocks that may be configured for multiple functions including RAM, FIFO, and peripherals. The double-data rate (DDR) I/O voltage tolerance of 3.3 V, allows the device to access both 1.8V and 3.3V SDRAMs.

The LCMXO3LF-2100C-5BG256I also offers the highest security of any currently available FPGA technology. The device includes on-chip Flash memory, a UART, encryption, and SHA-256 authentication. This security is provided without sacrificing processor performance or increasing board space or cost. Furthermore, the device also has a dual-supply voltage regulator to accommodate applications with high temperature operating ranges.

The LCMXO3LF-2100C-5BG256I is an ideal solution for low-cost, low-power embedded applications. The device offers flexibility and performance in a small footprint, and is designed to deliver the lowest power consumption, highest security, and best performance in its class. The device also offers a wide range of features including dual-data rate I/O, embedded Flash memory, encryption, and SHA-256 authentication for maximum security. The integrated circuit technology provides a fast, cost-effective solution for any embedded application requiring FPGA technology.

The specific data is subject to PDF, and the above content is for reference

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