LFE2-70SE-5FN900C Allicdata Electronics
Allicdata Part #:

LFE2-70SE-5FN900C-ND

Manufacturer Part#:

LFE2-70SE-5FN900C

Price: $ 96.59
Product Category:

Integrated Circuits (ICs)

Manufacturer: Lattice Semiconductor Corporation
Short Description: IC FPGA 583 I/O 900FBGA
More Detail: N/A
DataSheet: LFE2-70SE-5FN900C datasheetLFE2-70SE-5FN900C Datasheet/PDF
Quantity: 1000
27 +: $ 87.81010
Stock 1000Can Ship Immediately
$ 96.59
Specifications
Series: ECP2
Part Status: Active
Number of LABs/CLBs: 8500
Number of Logic Elements/Cells: 68000
Total RAM Bits: 1056768
Number of I/O: 583
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA
Supplier Device Package: 900-FPBGA (31x31)
Base Part Number: LFE2-70
Description

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The LFE2-70SE-5FN900C is a field programmable gate array (FPGA) device that offers a wealth of features and functionality for embedded applications. The device features 72,000 logic equivalents (LEs), 380 user-defined I/Os, up to 512 kbits of on-chip Distributed RAM, and the capability to implement up to 144 multipliers in 36-bit mode. It is also capable of running 12Gbps transceiver protocols, including PCI Express, USB 3.0, Gigabit Ethernet, and HyperTransport.

The FPGA\'s high-level applications fields include industrial automation, communications, military, automotive and consumer markets. The device is suitable for rapid prototyping, hardware acceleration, secure boot, and secure memory protection. In addition, the device enables users to develop application-specific integrated circuits (ASICs) for custom IP cores, reduce time-to-market, and significantly lower costs.

The LFE2-70SE-5FN900C is implemented using a flip-flop-based architecture for high-density logic, high speed signal routing and distributed memory blocks that provide built-in random access memory (RAM). The device utilizes both high-level and low-level programming tools, including Verilog, VHDL and C/C++, to create FPGA designs quickly and easily.

The FPGA also provides advanced I/O support with up to 380 I/Os, up to 36 multi-gigabit transceiver ports, and up to 32 high-speed differential fast I/O banks with support for LVDS, bus-keeper, 3-state, open-drain and HSTL signaling. The device also features a variety of built-in features to help protect against tampering, including programmable voltage and temperature monitoring, secure memory protection, and robust self-maintenance capabilities.

The basic working principle of an FPGA is to connect a large number of logic elements through a switching matrix. Each element is programmed to perform a certain logic operation. The logic elements can also be connected to each other by configurable connections, allowing users to develop complex digital systems. This programmable network of elements is called the reconfigurable fabric. The FPGA fabric can be programmed to implement a variety of digital functions, such as arithmetic operations, memory and communications.

In addition to the FPGA fabric, the device also includes additional components, such as block RAM (BRAM), Digital Signal Processor (DSP) module, System-on-Chip controller, and input/output (I/O) ports, to provide users with enhanced system capability. The device also contains a suite of powerful, high-performance development tools that streamline and simplify the design, verification, and implementation of FPGA-based applications.

The specific data is subject to PDF, and the above content is for reference

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