M1A3P1000L-FG144 Allicdata Electronics
Allicdata Part #:

M1A3P1000L-FG144-ND

Manufacturer Part#:

M1A3P1000L-FG144

Price: $ 48.05
Product Category:

Integrated Circuits (ICs)

Manufacturer: Microsemi Corporation
Short Description: IC FPGA 97 I/O 144FBGA
More Detail: N/A
DataSheet: M1A3P1000L-FG144 datasheetM1A3P1000L-FG144 Datasheet/PDF
Quantity: 1000
160 +: $ 43.68170
Stock 1000Can Ship Immediately
$ 48.05
Specifications
Series: ProASIC3L
Part Status: Active
Total RAM Bits: 147456
Number of I/O: 97
Number of Gates: 1000000
Voltage - Supply: 1.14 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LBGA
Supplier Device Package: 144-FPBGA (13x13)
Base Part Number: M1A3P1000L
Description

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Introduction to Embedded - FPGAs (Field Programmable Gate Array)

FPGAs are hardware devices that are programmable—or reconfigurable—well after they have been manufactured. They are composed of basic logic cells, such as gates and flip-flops, that are interconnected on a semiconductor device. Unlike Application Specific Integrated Circuits (ASICs), FPGAs can be programmed to implement all kinds of special-purpose functions. This means that any kind of wiring, logic, or task usually performed by a processor can now be done in the FPGA.

M1A3P1000L-FG144 FPGA Applications

The M1A3P1000L-FG144 FPGA is targeted for prototyping, system on chip (SoC) design, and low-power applications. It offers design flexibility, a high-performance bus architecture, and configurability features that enable designers to optimize their designs for any specific application. This FPGA is geared for applications like consumer, automotive, industrial control and medical. Specifically, the FPGA provides support for low-power datapath and communication applications, power and temperature aware systems, and SoC designs with deterministic and autonomous components and subsystems.

The M1A3P1000L-FG144 also supports an extended temperature range from -40 to +85°C, making it suitable for extended-temperature operation and harsh environment operation. It has high-speed I/O and port connections for supporting up to 16 multiple-clock domains and eight user selectable low power modes. The low-power cores are designed for low-voltage and low-power applications.

M1A3P1000L-FG144 Working Principles

The structure of M1A3P1000L-FG144 FPGA consists of three main components: Logic Elements (LEs), Configurable Logic Blocks (CLBs), and Input/Output Blocks (IOBs). The LE is the smallest unit of logic and the basic element of the FPGA. The CLBs are composed of a number of LEs,and they can be programmed to implement any logic function. The IOBs enable communications between external circuits and the FPGA\'s internal logic elements.

The Logic Element (LE) consists of several small logic devices with basic logic functions such as gates and flip-flops. They are typically grouped together in 8-bit or 16-bit blocks. The LEs are then connected to the Configurable Logic Blocks (CLBs) which are used for forming the most complex logical operations in the FPGA. The CLBs can be programmed to implement any logic function or combination of logic functions. Finally, the IOBs are used for connecting the FPGA to external devices and circuits.

The M1A3P1000L-FG144 FPGA also supports multiple clock domains and low-power features, as well as a wide range of peripherals. For example, it includes several communication interface modules to enable interfacing with external devices such as I2C, SPI, JTAG, etc. It also includes a wide range of voltage ranges, scaling to cover various power dissipation levels.

The M1A3P1000L-FG144 FPGA also features several low-power features such as energy-saving modes, low-voltage I/O, on-chip termination and adjustable power both at the chip and pin level. Furthermore, it supports multiple clock domains, from 2.5V to 5V and from 1 MHz to 100 MHz.

Conclusion

All in all, the M1A3P1000L-FG144 FPGA is a great choice for prototyping, system on chip (SoC) design, and low-power applications. It offers design flexibility, a high-performance bus architecture, and configurability features that enable designers to optimize their designs for any specific application. It also supports an extended temperature range and multiple clock domains, as well as various power dissipation levels. The low-power features and wide range of interface modules enable fast and easy development of any type of embedded system.

The specific data is subject to PDF, and the above content is for reference

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