Allicdata Part #: | M2S150T-FC1152I-ND |
Manufacturer Part#: |
M2S150T-FC1152I |
Price: | $ 234.56 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Microsemi Corporation |
Short Description: | IC FPGA SOC 150K LUTS 1152FCBGA |
More Detail: | ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusio... |
DataSheet: | M2S150T-FC1152I Datasheet/PDF |
Quantity: | 1000 |
24 +: | $ 213.23800 |
Series: | SmartFusion®2 |
Packaging: | Tray |
Part Status: | Active |
Architecture: | MCU, FPGA |
Core Processor: | ARM® Cortex®-M3 |
Flash Size: | 512KB |
RAM Size: | 64KB |
Peripherals: | DDR, PCIe, SERDES |
Connectivity: | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: | 166MHz |
Primary Attributes: | FPGA - 150K Logic Modules |
Operating Temperature: | -40°C ~ 100°C (TJ) |
Package / Case: | 1152-BBGA, FCBGA |
Supplier Device Package: | 1152-FCBGA (35x35) |
Number of I/O: | 574 |
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The M2S150T-FC1152I is a high-performance system-on-chip that is designed to provide a powerful, cost-effective embedded solution for a wide range of applications. The device is a powerful processing unit that combines an ARM Cortex-M3 processor core, high-performance peripherals, memory controllers, advanced analog features, and Power Management schemes on a single low-cost chip.
M2S150T-FC1152I is suitable for a wide range of embedded applications, from industrial automation and medical equipment to embedded controllers, robotics and smart homes. The scalability and flexibility of the device make it ideal for design projects requiring low-power, high-performance embedded solutions.
At the heart of the M2S150T-FC1152I is the ARM Cortex-M3 processor core, which is optimized for low-power operation and high-performance processing. The device also includes an arsenal of peripherals, including UART, I2C, SPI, PWM, ADC, and DAC. In addition, the device features multiple memory controllers, on-chip flash memory, SRAM, and an optional external memory controller.
The M2S150T-FC1152I also features a variety of integrated power management schemes to ensure reliable operation. These include clock gating, dynamic power management, and multiple power saving modes designed to maximize battery life. In addition, the device also ships with typical thermal management features to ensure that it operates within its specified temperature range.
The main application field of M2S150T-FC1152I includes industrial IoT, industrial control, industrial automation, medical instrumentation, printing control, communications base station, and video surveillance. As for the working principle of M2S150T-FC1152I, its system architecture comprises of a Cortex-M3 processor core, memories, and peripherals, which are connected to high performance fabric blocks like AMBA AHB, AHB-Lite, and APB. The fabric blocks enable the processor core and peripherals to communicate and exchange data, which facilitates the majority of embedded system functions.
The M2S150T-FC1152I also provides optimization and power management options that include clock gating and dynamic power management. Clock gating is a technique used to reduce the power consumption of a system by selectively shutting off clocks to inactive parts of the system. This can be used to shut off the processor core and peripherals when they are not in use. Dynamic power management is another technique used to reduce power consumed by a system by adjusting the frequency and voltage of the system\'s core. This can be used to reduce the power usage of the processor core and increase the overall system efficiency.
In summary, the M2S150T-FC1152I is a powerful and cost-effective embedded system-on-chip solution for a variety of embedded solutions. The device is flexible and scalable, offering a number of power management options and thermals management features. Its main application field includes industrial IoT, industrial control, industrial automation, medical instrumentation, printing control, communications base station, and video surveillance. The device works based on the system architecture of Cortex-M3 processor core, memories, and peripherals, enhanced by high performance fabric blocks.
The specific data is subject to PDF, and the above content is for reference
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