MBR1550ULPS-TP Discrete Semiconductor Products |
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Allicdata Part #: | MBR1550ULPS-TPMSTR-ND |
Manufacturer Part#: |
MBR1550ULPS-TP |
Price: | $ 0.27 |
Product Category: | Discrete Semiconductor Products |
Manufacturer: | Micro Commercial Co |
Short Description: | DIODE SCHOTTKY 50V 15A TO277B |
More Detail: | Diode Schottky 50V 15A Surface Mount TO-277B |
DataSheet: | MBR1550ULPS-TP Datasheet/PDF |
Quantity: | 1000 |
5000 +: | $ 0.24696 |
Series: | -- |
Packaging: | Tape & Reel (TR) |
Part Status: | Active |
Diode Type: | Schottky |
Voltage - DC Reverse (Vr) (Max): | 50V |
Current - Average Rectified (Io): | 15A |
Voltage - Forward (Vf) (Max) @ If: | 470mV @ 15A |
Speed: | Fast Recovery = 200mA (Io) |
Current - Reverse Leakage @ Vr: | 300µA @ 50V |
Capacitance @ Vr, F: | -- |
Mounting Type: | Surface Mount |
Package / Case: | TO-277, 3-PowerDFN |
Supplier Device Package: | TO-277B |
Operating Temperature - Junction: | -55°C ~ 150°C |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The MBR1550ULPS-TP is a single Schottky diode that is designed to be host-friendly and has a low power consumption. It is an ideal choice for applications requiring low power and low-burden circuit designs. It is one of the most efficient and cost effective Schottky diodes in the market today.
The MBR1550ULPS-TP is designed to be used as part of an integrated circuit, with applications such as protection against over-voltage, electromagnetic interference, and reverse current. Its applications include power supply rectification, voltage clamping, and high frequency rectification. It has a low forward voltage drop and a high reverse recovery time.
The MBR1550ULPS-TP has a reverse voltage of up to 15V and a forward current of 1.5A. It is able to operate in temperatures ranging from -40°C to 125°C. Its low power requirements make it an ideal choice for embedded applications.
This single Schottky diode’s working principle is based on the p-n junction rectifying effect, which occurs when negative charges are injected from the p-side to the n-side of a semiconductor material. Under the influence of applied electric fields, the direction of the current flow is determined by the differences in the densities of holes and electrons on the respective sides of the junction. In contrast to the p-n junction diode, the Schottky diode has no junction depletion layer and hence, has no reverse blocking capability.
The standard construction of a Schottky diode generally consists of a P-type semiconductor substrate with a thin metal layer deposited on it. The metal layer is usually a material such as nickel, silver, or aluminum, but gold is also sometimes used. The metal must be a good conductor of electrons and should have a low work function. The purpose of the metal layer is to reduce the barrier height for electrons and hence, to reduce the forward voltage drop. This makes the Schottky diode ideal for applications where low voltage drops are necessary, such as voltage clamping.
The Schottky diode’s operating mechanism is based on the Schottky barrier formed at the interface between the metal layer and the P-type substrate. The barrier height is determined by the difference in the Fermi levels between the metal and the substrate. This in turn will determine the forward voltage drop of the diode and the reverse current. When a forward voltage is applied, the electrons from the metal layer will start to travel through the junction. The level of current will be determined by the Fermi level difference and the resistance of the junction. As the current increases, the resistance of the junction will also increase, further limiting the forward current.
In conclusion, the MBR1550ULPS-TP is a single Schottky diode that is designed to be host-friendly and has a low power consumption. It has a low forward voltage drop and a high reverse recovery time. Its applications include power supply rectification, voltage clamping, and high frequency rectification. Its working mechanism is based on the Schottky barrier formed at the metal/P-type substrate interface.
The specific data is subject to PDF, and the above content is for reference
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