Allicdata Part #: | MC68MH360ZQ25L-ND |
Manufacturer Part#: |
MC68MH360ZQ25L |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | NXP USA Inc |
Short Description: | IC MPU M683XX 25MHZ 357BGA |
More Detail: | CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25M... |
DataSheet: | MC68MH360ZQ25L Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Ethernet: | 10 Mbps (1) |
Base Part Number: | MC68MH360 |
Additional Interfaces: | SCC, SMC, SPI |
Supplier Device Package: | 357-PBGA (25x25) |
Package / Case: | 357-BBGA |
Security Features: | -- |
Operating Temperature: | 0°C ~ 70°C (TA) |
Voltage - I/O: | 5.0V |
USB: | -- |
SATA: | -- |
Series: | M683xx |
Display & Interface Controllers: | -- |
Graphics Acceleration: | No |
RAM Controllers: | DRAM |
Co-Processors/DSP: | Communications; CPM |
Speed: | 25MHz |
Number of Cores/Bus Width: | 1 Core, 32-Bit |
Core Processor: | CPU32+ |
Part Status: | Obsolete |
Packaging: | Tray |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The MC68MH360ZQ25L is a 32-bit embedded microprocessor that is designed to perform complex operations at high speeds. This type of processor is found in a variety of applications including automotive, home appliances, industrial controllers, and other embedded systems. The key features of this type of device are its strong computational power, high clock frequency, low power consumption, and ability to integrate multiple IP blocks.
The MC68MH360ZQ25L is a single-instruction, multiple-data (SIMD) microprocessor. This means that it can process multiple transactions or instructions simultaneously. This processor is especially suited for compute intensive applications like digital signal processing, image processing, and other embedded applications that require a high-performance processor.
The MC68MH360ZQ25L is a highly integrated device that contains several on-chip peripherals and controls. Some of these peripherals include DMA, UART, SSI, Quad-SPI, and I2C. This processor also contains several advanced features such as an integrated Direct Memory Access (DMA) controller to manage the flow of data between different peripherals and memories. It also has an IEEE754-compatible floating-point processor unit (FPU) and a dedicated programmable interrupt controller (PIC).
The MC68MH360ZQ25L uses the industry standard 32-bit ARM Cortex-M3 processor core. This core has been designed to offer a high level of performance and power efficiency. The Cortex-M3 core is optimized for low-power consumption, which makes it ideal for applications that require long battery life such as portable devices and battery powered systems. The ARM Cortex-M3 is also highly scalable, allowing developers to create applications with a wide range of performance and power consumption requirements.
The MC68MH360ZQ25L has a non-volatile memory which allows the processor to retain information even when it is powered down. This type of memory is essential for embedded applications that need to maintain data for a long time even when power is disconnected. This non-volatile memory also helps protect the processor against any kind of power failure or interruptions.
The MC68MH360ZQ25L supports power management functions such as voltage and temperature monitoring and thermal regulation. This type of power management allows the processor to reduce or increase its power consumption depending on the application’s power needs and the environment it is in. This helps increase the battery life of the system and reduce its overall power consumption.
The MC68MH360ZQ25L is a highly integrated embedded microprocessor which enables developers to create applications that are low power, highly efficient, and feature rich. This processor is ideal for applications that require a high level of performance and demand minimal power. The ARM Cortex-M3 core provides an optimal balance of performance, power efficiency, and scalability, and the on-chip peripherals and power management features offer further flexibility and improve the embedded system’s overall power efficiency.
The specific data is subject to PDF, and the above content is for reference
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