MC68HC711E9CFN3

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1. Describe

This document contains a detailed description of the MC68HC711E9CFN3 E-series 8-bit microcontroller unit (MCU). These MCUs combine the M68HC11 central processing unit (CPU) with high-performance, On-chip peripherals. The E-Series consists of a number of devices with various configurations:

    1. Random Access Memory (RAM)

    2. Read only memory (ROM)

    3. Erasable Programmable Read Only Memory (EPROM)

    4. Electrically Erasable Programmable Read Only Memory (EEPROM)

    5. Various low voltage devices are also available.

Aside from a few minor differences, the operation of all E-Series MCUs is the same. The fully static design and high-density complementary metal-oxide-semiconductor (HCMOS) fabrication process enables the E-series devices to operate in the 3 MHz to DC range with very low power consumption.

2. Feature

    1. M68HC11 CPU

    2. Power-saving stop and wait modes

    3. Low voltage equipment available (3.0–5.5 Vdc)

    4. 0, 256, 512 or 768 bytes of on-chip RAM to retain data during standby

    5. 0, 12 or 20 KB on-chip ROM or EPROM

    6. 0, 512 or 2048 bytes of on-chip EEPROM with block protection for security

    7. 2048 bytes of EEPROM with selectable base address in MC68HC811E2

    8. Asynchronous non-return-to-zero (NRZ) serial communication interface (SCI)

    9. MC68HC(7)11E20 provides additional baud rate

  10. Synchronous Serial Peripheral Interface (SPI)

  11. 8-channel, 8-bit analog-to-digital (A/D) converter

  12. 16-bit timer system:

        – Three input capture (IC) channels

        – Four output compare (OC) channels

        – An additional channel with the option of a fourth IC or a fifth OC

  13. 8-bit pulse accumulator

  14. Real-time interrupt circuit

  15. Computer Uptime (COP) watchdog system

  16. 38 general-purpose input/output (I/O) pins:

        – 16 bidirectional I/O pins

        – 11 input-only pins

        – 11 output-only pins

  17. Multiple packaging options:

        – 52-pin plastic leaded chip carrier (PLCC)

        – 52-pin window ceramic leaded chip carrier (CLCC)

        – 52-pin plastic thin quad flat pack, 10 mm x 10 mm (TQFP)

        – 64-pin Quad Flat Pack (QFP)

        – 48-pin plastic dual in-line package (DIP), MC68HC811E2 only

        – 56-Pin Plastic Shrink Dual In-Line Package, 0.070-inch Lead Pitch (SDIP)

3. Pin configuration

4. Pin Description

The M68HC11 E-series MCUs are available in the following packages:

    1. 52-pin plastic leaded chip carrier (PLCC)

    2. 52-pin window ceramic leaded chip carrier (CLCC)

    3. 52-pin plastic thin quad flat pack, 10 mm x 10 mm (TQFP)

    4. 64-pin Quad Flat Pack (QFP)

    5. 48-pin plastic dual in-line package (DIP), MC68HC811E2 only

    6. 56-Pin Plastic Shrink Dual In-Line Package, 0.070 Inch Lead Pitch (SDIP)

Most pins on these MCUs serve two or more functions.