Allicdata Part #: | MCP9843-BE/ST-ND |
Manufacturer Part#: |
MCP9843-BE/ST |
Price: | $ 0.61 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Microchip Technology |
Short Description: | IC TEMP SENSOR DGTL 8-TSSOP |
More Detail: | Temp Monitoring System (Sensor) -40°C ~ 125°C Inte... |
DataSheet: | MCP9843-BE/ST Datasheet/PDF |
Quantity: | 584 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
1 +: | $ 0.55440 |
25 +: | $ 0.46066 |
100 +: | $ 0.42179 |
Series: | -- |
Packaging: | Tube |
Lead Free Status / RoHS Status: | -- |
Part Status: | Active |
Moisture Sensitivity Level (MSL): | -- |
Function: | Temp Monitoring System (Sensor) |
Sensor Type: | Internal |
Sensing Temperature: | -40°C ~ 125°C |
Accuracy: | ±3°C(Max) |
Topology: | ADC (Sigma Delta), Register Bank |
Output Type: | I²C/SMBus |
Output Alarm: | Yes |
Output Fan: | No |
Voltage - Supply: | 2.7 V ~ 5.5 V |
Operating Temperature: | -40°C ~ 125°C |
Mounting Type: | Surface Mount |
Package / Case: | 8-TSSOP (0.173", 4.40mm Width) |
Supplier Device Package: | 8-TSSOP |
Base Part Number: | MCP9843 |
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PMIC - Thermal Management is the process of controlling and monitoring the temperature of devices such as processors, memory, and other components in order to prevent them from becoming too hot and potentially causing damage. The MCP9843-BE/ST is an ideal thermal management solution for high-power applications.
The MCP9843-BE/ST is a high-power, digital thermal-control system-on-a-chip that operates at over 80°C. It provides users with an integrated temperature-sensing and thermal-control solution, allowing for a more efficient, reliable, and cost-effective operation. The MCP9843-BE/ST is designed to provide accurate measurements and efficient thermal control for applications operating in extreme temperatures.
The MCP9843-BE/ST features an integrated die temperature sensor and a discrete remote temperature sensor. The die temperature sensor is used to measure the temperature of the integrated circuits while the remote temperature sensor measures the temperature of the surrounding environment. The MCP9843-BE/ST can be configured to monitor either the internal die temperature or the external temperature using the remote sensor. With the integrated onboard memory and EEPROM, users can configure the MCP9843-BE/ST for specific applications.
The MCP9843-BE/ST also features an on-chip thermal response circuit. This circuit helps to ensure that the temperature of the integrated circuit is kept within optimal operating conditions. The thermal response circuit monitors the die temperature of the MCP9843-BE/ST and adjusts the power consumption appropriately. Additionally, the MCP9843-BE/ST features three control registers that can be used to adjust the thermal response parameters.
The MCP9843-BE/ST can be used in a wide range of applications including computing, embedded systems, industrial, medical, and telecommunications. It can be used to monitor and control various aspects of the system such as processor, memory, and other components. The MCP9843-BE/ST can be used in conjunction with other thermal control systems such as fan controllers or heat sinks to ensure optimal performance and to prevent damage to the components.
In terms of performance, the MCP9843-BE/ST is designed to accurately measure and control the temperature of the die within a wide range of temperatures. It is able to provide users with an accurate temperature reading and efficient thermal control. Additionally, the MCP9843-BE/ST features a wide input range of 0.9Vcc to 3.6Vcc and provides users with low power consumption.
Overall, the MCP9843-BE/ST is an ideal thermal management solution for high-power applications. It features an integrated die temperature sensor, a discrete remote temperature sensor, an on-chip thermal response circuit, and low power consumption. The MCP9843-BE/ST can be used in various applications, including computing, embedded systems, industrial, medical, and telecommunications, and can be used in conjunction with other thermal control systems to ensure optimal performance and to prevent damage to the components.
The specific data is subject to PDF, and the above content is for reference
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