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Introduction

The MMD23-0051K1 backplane connector is a specialized connector that is used to connect two or more PCB modules, devices, or other components for power or signal transmission. This type of connector is often used for improving the performance of high-speed applications such as embedded systems, industrial automation, automotive networks, and communications systems. The MMD23-0051K1 features two gold-plated source pins and two gold-plated contact pins.

Application Field

The MMD23-0051K1 is designed for applications in high-speed data transfer networks, allowing each individual unit to communicate with the other using up to 1 Gb/s per channel. It is commonly used in advanced embedded systems, such as those found in telecommunications networks, automotive networks, and motorsport systems. Other applications include exotic backplane arrangements such as the connection of multiple daughter boards and STIG modules.

Working Principle

The MMD23-0051K1 operates on the principle of hot-plugging. It is capable of providing both power and signal paths, allowing the device to connect with and transfer data between two or more modules and boards. The MMD23-0051K1 consists of two gold-plated source pins and two gold-plated contact pins. The source pins send the data to the contacts and the contacts transmit the data from the source pins to the module or board.

Design Features

The MMD23-0051K1 is designed for applications where high-speed data transfer is required. It is capable of transferring up to 1 Gb/s per channel for up to two channels. The MMD23-0051K1 has an integrally designed robust contact design for higher reliability, and it also features an overrating factor of 2.5 times for improved heat dissipation.

Conclusion

MMD23-0051K1 backplane connectors are designed for applications that require high-speed data transmission. It is capable of providing both power and signal paths, allowing for connection and data transfer between two or more modules and boards. The MMD23-0051K1 offers an integrally designed robust contact design for higher reliability, as well as an overrating factor of 2.5 times for better heat dissipation. It is widely used in embedded systems, industrial automation, automotive networks, and communications systems.

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