MMD25-0201P1

The MMD25-0201P1 backplane connector is designed for high-density backplane interconnections. It is a General Purpose test and instrumentation connector. As a specialized backplane connector, the MMD25-0201P1 supports the three popular form factors used in the IT infrastructure market–PC100, PC133, and PC800. It supports up to 31 contact positions on a 1.6 mm pitch and is also cable selectable.

The MMD25-0201P1 interconnect solutions enable user-friendly design and reduced installation time while offering backward compatibility with existing systems. The MMD25-0201P1 employs a flexible and variably pitchable double row pin interface that can be delivered in selectable and user-configurable lengths of 0.6mm or 1.6mm. Through careful design of materials and manufacturing processes, the MMD25-0201P1 also meets modern varied environmental standards, including shock and vibration, EMI shielding, thermal cycling, and temperature cycling.

The main application field of the MMD25-0201P1 backplane connector is in Information Technology. It was designed to meet the selectable interconnect requirements of high-speed systems across PC 100, PC 133, and PC 800 form factors. It enables standard or customized lengths of 0.6mm and 1.6mm while meeting high-speed requirements for proven and reliable connectivity. This makes the MMD25-0201P1 ideal for interconnection of IT-grade equipment.

The working principle of the MMD25-0201P1 is to provide maximum compatibility and reliable signal integrity through its design. The contact interface of the MMD25-0201P1 is made of a double row of pins with a flexible and variably pitchable contact design. This allows for selectable lengths of 0.6mm and 1.6mm. In addition, to provide optimum signal integrity, employ is dual shield design. Shields are critically placed at the front and back loops and have grounded contact fingers. To ensure reliable connections, the contacts are constructed of gold plating over a palladium-nickel alloy while the housings are constructed of a non-magnetic gold-over-nickel alloy.

In conclusion, the MMD25-0201P1 backplane connector is designed for high-density backplane interconnections and is a specialized backplane connector that supports PC100, PC133, and PC800 form factors. Its working principle is to provide maximum compatibility and reliable signal integrity through its flexible and variably pitchable contact design and its dual shield design. Its main applications are in the Information Technology industry, and it is a cost-effective solution for reliable interconnection of IT-grade equipment.