MMZ2012Y301BT000

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Ferrite Beads and Chips are an important component of electronic engineering. The MMZ2012Y301BT000 is a ferrite bead and chip specifically designed for applications such as EMI/RFI shielding, grounding, and impedance matching. The MMZ2012Y301BT000 is widely used across various industries to reduce EMI/RFI interference and to provide signal integrity and isolation.

The MMZ2012Y301BT000 is a 1206-sized ferrite chip with a gold-plated brass substrate. It features two mounting holes for mechanical stability and enhanced reliability. This chip has a maximum operating frequency of 26GHz and a β pow value of 15dB at 10GHz. The package includes a copper alloy shim plate that provides good thermal conduction and recyclability for enhanced performance.

The MMZ2012Y301BT000 is designed to reduce EMI/RFI interference in applications such as digital telecom systems, computer peripherals, cable modem, and automotive electronics. It also shields against high-frequency switching noise from digital CMOS and RF circuits. The ferrite chip is able to dissipate heat effectively and provides good isolation characteristics between high-frequency signals.

The working principle of the MMZ2012Y301BT000 ferrite chip is based on the use of ferromagnetic material. When an electrical current is applied to the chip, the material’s magnetic field will be activated. This magnetic field creates an electrical field which interacts with the current and reduces its intensity. This results in less interference and better signal isolation. The ferrite chip also acts as a shield against EMI/RFI signals.

In addition to the EMI/RFI signal reduction, the MMZ2012Y301BT000 has also been designed to provide good grounding capability. The gold-plated brass substrate provides a low-impedance path for the signal ground, ensuring minimized crosstalk and improved signal integrity. The copper alloy shim plate provides additional conductive pathways that enhance grounding performance and reduce heat buildup.

The MMZ2012Y301BT000 ferrite chip is an ideal solution for applications where high-frequency interference may be an issue. This chip offers excellent signal integrity and isolation, as well as effective EMI/RFI shielding. It has a wide operating frequency range and provides reliable grounding performance. The chip’s design ensures good thermal conduction and recyclability, making it an excellent choice for various industries.

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