Allicdata Part #: | 1589-1533-2-ND |
Manufacturer Part#: |
MP1584EN-LF-Z |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Monolithic Power Systems Inc. |
Short Description: | IC REG BUCK ADJ 3ABuck Switching Regulator IC Posi... |
More Detail: | N/A |
DataSheet: | MP1584EN-LF-Z Datasheet/PDF |
Quantity: | 1000 |
Series: | MP1584 |
Packaging: | Tape & Reel (TR) |
Part Status: | Active |
Function: | Step-Down |
Output Configuration: | Positive |
Topology: | Buck |
Output Type: | Adjustable |
Number of Outputs: | 1 |
Voltage - Input (Min): | 4.5V |
Voltage - Input (Max): | 28V |
Voltage - Output (Min/Fixed): | 0.8V |
Voltage - Output (Max): | 25V |
Current - Output: | 3A |
Frequency - Switching: | 100kHz ~ 1.5MHz |
Synchronous Rectifier: | No |
Operating Temperature: | -20°C ~ 85°C (TA) |
Mounting Type: | Surface Mount |
Package / Case: | 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
Supplier Device Package: | 8-SOIC-EP |
Base Part Number: | MP1584 |
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1. DESCRIPTION
The MP1584EN-LF-Z is a high frequency step-down switching regulator with an integrated internal high-side high voltage power MOSFET. It provides 3A output with current mode control for fast loop response and easy compensation. The wide 4.5V to 28V input range accommodates a variety of step-down applications, including those in an automotive input environment. A 100µA operational quiescent current allows use in battery-powered applications. High power conversion efficiency over a wide load range is achieved by scaling down the switching frequency at light load condition to reduce the switching and gate driving losses. The frequency foldback helps prevent inductor current runaway during startup and thermal shutdown provides reliable, fault tolerant operation. By switching at 1.5MHz, the MP1584 is able to prevent EMI (Electromagnetic Interference) noise problems, such as those found in AM radio and ADSL applications. The MP1584 is available in a thermally enhanced SOIC8E package.
2. FEATURES
1. Wide 4.5V to 28V Operating Input Range
2. Programmable Switching Frequency from 100kHz to 1.5MHz
3. High-Efficiency Pulse Skipping Mode for Light Load
4. Ceramic Capacitor Stable
5. Internal Soft-Start
6. Internally Set Current Limit without a Current Sensing Resistor
7. Available in SOIC8E Package.
3. APPLICATIONS
1. High Voltage Power Conversion
2. Automotive Systems
3. Industrial Power Systems
4. Distributed Power Systems
5. Battery Powered Systems
4. Internal Regulator
Most of the internal circuitries are powered from the 2.6V internal regulator. This regulator takes the VIN input and operates in the full VIN range. When VIN is greater than 3.0V, the output of the regulator is in full regulation. When VIN is lower than 3.0V, the output decreases.
5. High Frequency Operation
The switching frequency of MP1584 can be programmed up to 1.5MHz with an external resistor. With higher switching frequencies, the inductive reactance (XL) of capacitor comes to dominate, so that the ESL of input/output capacitor determines the input/output ripple voltage at higher switching frequency. As a result of that, high frequency ceramic capacitor is strongly recommended as input decoupling capacitor and output filtering capacitor for such high frequency operation. Layout becomes more important when the device switches at higher frequency. It is essential to place the input decoupling capacitor, catch diode and the MP1584 (Vin pin,SW pin and PGND) as close as possible, with traces that are very short and fairly wide. This can help to greatly reduce the voltage spike on SW node, and lower the EMI noise level as well. Try to run the feedback trace as far from the inductor and noisy power traces as possible. It is often a good idea to run the feedback trace on the side of the PCB opposite of the inductor with a ground plane separating the two. The compensation components should be placed closed to the MP1584. Do not place the compensation components close to or under high dv/dt SW node, or inside the high di/dt power loop. If you have to do so, the proper ground plane must be in place to isolate those. Switching loss is expected to be increased at high switching frequency. To help to improve the thermal conduction, a grid of thermal vias can be created right under the exposed pad. It is recommended that they be small (15mil barrel diameter) so that the hole is essentially filled up during the plating process, thus aiding conduction to the other side. Too large a hole can cause‘solder wicking’ problems during the reflow soldering process. The pitch (distance between the centers) of several such thermal vias in an area is typically 40mil.
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