MPZ1005S900HT000

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Ferrite beads and chips are two further sub-categories of ferrite devices. Ferrite beads, which are cylindrical in shape, are used to construct a small filter and dampen signal radiation, signal noise, and EMI/RFI interference. Ferrite chips are usually thin ceramic blocks and are generally used to eliminate switching transients, signal noise, and EMI/RFI interference.

MPZ1005S900HT000 is a ferrite bead product that combines the benefits of both ferrite beads and chips. It is made of a high-temperature sintered material, possesses an ultra-low inductance, and its chip and bead combined design reduces radiated emissions and conducted RFI noise in applications required for higher frequency and signal integrity. It is suitable for many application fields, such as mobile base stations, base transceiver stations, X-ray detectors, antennas, and electro-optical devices.

MPZ1005S900HT000 has no internal lead wires like some other ferrite devices, so it does not depend on such delicate structures like traditional MMZ products. It also has a low current noise and a small profile that can fit in narrow spaces. In addition, it provides improved EMC/EMI performance, helping cut EMI costs.

The working principle of MPZ1005S900HT000 is based on the same theory of other ferrite devices. It absorbs high-frequency fields in the near-field zone, producing a short-circuited dipole antenna with a length of 1/10 to 1/20 of the wavelength of the signal. This antenna is usually referred to as an intrinsic filter, and its characteristics depend on the antenna\'s length, as well as its shape and size. In this way, MPZ1005S900HT000 works as an electromagnetic shield, filtering out electromagnetic interference and reducing noise in the application.

MPZ1005S900HT000 is a revolutionary new ferrite device that combines the benefits of both ferrite beads and chips. It offers users a high-performance EMI/RFI solution for applications requiring higher frequency and signal integrity and is suitable for a variety of applications. Its combined chip and bead design helps reduce radiated emissions and conducted RFI noise, all while providing an improved EMI performance and helping to cut EMI costs.

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