MT18KDF51272PDZ-1G6K1

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MT18KDF51272PDZ-1G6K1 is a type of memory module designed and manufactured by Micron Technology, Inc. It is part of the high-performance DDR3 module family and features 1Gbit die capacity and dual-rank diffuse type. The device is optimized for high-speed data transfer and offers low power consumption and high reliability.

The MT18KDF51272PDZ-1G6K1 memory module is used in a variety of applications. It is suitable for use in servers and workstations that require high-speed memory solutions, and can be used in industrial, embedded, and automotive applications. This memory module is also used in data centres, scientific and supercomputing environments, and cloud computing solutions.

The MT18KDF51272PDZ-1G6K1 memory module employs a single-ended input/output (SEI/O) architecture, which offers a wide range of I/O speeds and support for various data processing operations. This module is capable of up to 1.5GB/s data rates, and offers a wide range of data transfer protocols, including PC3-14400/DDR3-1800, PC4-17200/DDR3-2133, and PC4-19200/DDR3-2400. The module also supports multiple error correction codes (ECCs) and has an integrated thermal detection circuit.

In addition, the MT18KDF51272PDZ-1G6K1 memory module also supports various power saving features. It is compliant with all major memory standards such as JEDEC MO-269 and RoHS. The module is designed for use in high-end server and workstation applications and is compatible with multiple operating systems.

The working principle and operation of the MT18KDF51272PDZ-1G6K1 memory module are relatively simple. The module is activated through a set of electrical signals sent to the device by the system. The signals are processed by the controller which then sends commands to other components in order to execute the requested tasks. For example, when a program is executed, the processor sends commands to the memory module to load the program and data into its internal memory array.

The data transfer between the memory module and other devices takes place through the memory data bus. This bus is used to transfer the necessary commands and data between the processor, memory subsystem, main memory, and other peripherals. It is also used to read and write data between the memory and the cache.

The MT18KDF51272PDZ-1G6K1 memory module features a number of protection measures, including temperature monitoring, voltage regulation, and self-test capabilities. All of these features ensure that the device remains operational in a wide range of conditions and provide reliable data storage and retrieval.

In conclusion, the MT18KDF51272PDZ-1G6K1 memory module is a reliable and high-performance solution for a variety of memory applications. Its SEI/O architecture and wide range of supported protocols make it an ideal choice for high-speed data processing and storage applications. The integrated thermal detection circuit and other memory protection features ensure that the device remains operational even in extreme temperatures and conditions. All in all, it is an ideal choice for server, workstation, data centre, and cloud computing memory solutions.

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