
Allicdata Part #: | MTFC4GMTEA-1FWT-ND |
Manufacturer Part#: |
MTFC4GMTEA-1F WT |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Micron Technology Inc. |
Short Description: | IC FLASH 32G MMC 153WFBGA |
More Detail: | FLASH - NAND Memory IC 32Gb (4G x 8) MMC 153-WFB... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | e•MMC™ |
Packaging: | Tray |
Part Status: | Obsolete |
Memory Type: | Non-Volatile |
Memory Format: | FLASH |
Technology: | FLASH - NAND |
Memory Size: | 32Gb (4G x 8) |
Write Cycle Time - Word, Page: | -- |
Memory Interface: | MMC |
Voltage - Supply: | 2.7 V ~ 3.6 V |
Operating Temperature: | -25°C ~ 85°C (TA) |
Mounting Type: | Surface Mount |
Package / Case: | 153-WFBGA |
Supplier Device Package: | 153-WFBGA (11.5x13) |
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Memory is a key part of any digital system as it stores digital information for use later. Memory can be divided into three basic categories: non-volatile, volatile, and mobile. Among these, non-volatile memory is the most reliable and long-lasting, as it can store data for extended periods of time even without power.Volatile memory, such as random access memory (RAM), requires active power to retain data and provide access to the stored items. Mobile memory, such as flash memory, is designed to be used in portable devices such as phones and tablets.
The phrase MTFC4GMTEA-1F WT is used to describe a type of non-volatile memory device developed by Samsung. The “MT” stands for Multi Interface Memory Tablet, the “F” stands for ferroelectric RAM, the “C” stands for chip, and the “4GMTEA” stands for 4 Gb Multi-Level Cell. The “1F” stands for X3 Type of Ultra-Fast Data Transfer and “WT” stands for, Wide Temperature Range. This specific memory device is small in size and offers higher performance and capacities than conventional non-volatile memory devices.
The MTFC4GMTEA-1F WT is typically used in consumer applications or industrial systems with high memory density and high performance requirements. It is also used in embedded applications that demand low power consumption, non-volatility, and high reliability. The device is often used in data logging, mobile applications, industrial automation, and digital signage.
The MTFC4GMTEA-1F WT device operates on a ferroelectric RAM (FRAM) technology, which is a type of non-volatile memory. The main benefit of FRAM technology is that it provides higher endurance and increased speeds compared to flash technology. It can also withstand extreme temperatures (-55-125℃), making it ideal for automotive, industrial, and aerospace applications. In addition, it provides low power consumption and highly reliable data retention. The memory device can support up to 220 IOPS, making it suitable for applications that require high performance.
In addition to its endurance and performance, the device also offers better energy efficiency compared to competing memory devices. This is accomplished by using clock gating, power gated cells, and dynamic voltage and frequency scaling techniques. Furthermore, the device supports a variety of interface protocols, including Serial Peripheral Interface Bus (SPI), Quad-SPI, and HyperBus. Additionally, the device also supports a wide temperature range of -55 to 125℃, making it ideal for automotive, industrial automation, and aerospace applications.
The MTFC4GMTEA-1F WT also provides enhanced security for its stored data. The device employs on-die ECC (Error Correction Code) function and memory scrambling, which are essential for ensuring data integrity. Additionally, the device supports secure boot functionality which ensures that only authorized programs are executed and that unauthorized modifications cannot be made. In addition, the device also utilizes encryption techniques to protect stored data from being accessed by unauthorized parties.
The MTFC4GMTEA-1F WT non-volatile memory device is a versatile and high-performance memory solution for a variety of embedded applications. It is ideal for applications that require high speed, low power consumption, and high reliability. In addition, the device is also designed to withstand extreme temperatures, making it suitable for automotive, industrial, and aerospace applications.
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