
Allicdata Part #: | MX30UF4G18AB-TI-ND |
Manufacturer Part#: |
MX30UF4G18AB-TI |
Price: | $ 6.97 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Macronix |
Short Description: | IC FLASH 4GBIT |
More Detail: | Memory IC |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 6.97000 |
10 +: | $ 6.76090 |
100 +: | $ 6.62150 |
1000 +: | $ 6.48210 |
10000 +: | $ 6.27300 |
Specifications
Series: | * |
Part Status: | Active |
Description
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Introduction to MX30UF4G18AB-TI
MX30UF4G18AB-TI is a high-performance dynamic random-access memory (dynamic RAM or DRAM) device. It was developed by Toshiba, one of the world\'s leading semiconductor vendors. It has an access time of 4.5ns, a clock frequency of 400MHz, and a memory density of 2GB. This device is ideal for use in applications requiring high performance, such as server and gaming systems.Application Fields
The MX30UF4G18AB-TI device is used for a wide variety of applications, ranging from embedded systems, gaming systems, server applications, graphic accelerators, and medical systems.In embedded systems, MX30UF4G18AB-TI combines the low power consumption and small size of an embedded chip with the high speed of DRAM. This makes it ideal for use as internal memory in small systems. Additionally, the high speed and large memory density make it an attractive option for gaming systems that require a large amount of memory.Server applications also benefit from the combination of low power consumption and high speed of this device. Due to its high speed and large memory density, it is ideal for server applications that require a large amount of data to be quickly accessed.The ergonomics of the device make it a great choice for medical systems. Its ability to maintain functionality at low power consumption makes it ideal for medical systems that must be continuously on and that require a large amount of memory.Working Principle
MX30UF4G18AB-TI is composed of a semiconductor material, such as silicon, silicone, or gallium arsenide. A memory cell array is constructed on the substrate of these materials, made up of millions of cells where data can be stored and accessed.Each cell holds a single bit of information, with a single transistor and three capacitors making up each cell. When a bit needs to be written to, a voltage is applied to the cell\'s "control gate" to allow electrons to flow into the capacitor. In order to read the data, the voltage applied to the gate is reversed, allowing the electrons stored in the capacitor to flow out and change the voltage of the cell.Conclusion
The MX30UF4G18AB-TI device is an incredibly fast dynamic random-access memory device. It is ideal for embedded systems, gaming systems, server applications, graphic accelerators, and medical systems. This is due to its combination of low power consumption and high speed, as well as its large memory density. The working principle of this device is based on the construction of a memory cell array, where each cell is composed of a single transistor and three capacitors. All these factors combined make the MX30UF4G18AB-TI device ideal for a wide variety of applications.The specific data is subject to PDF, and the above content is for reference
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