P716B-WAFER-TESTED

P716B-WAFER-TESTED is a testing technology developed by Applied Material Engineering that is used to inspect the condition and quality of semiconductor wafers. This technology uses a combination of vision imaging and eddy current techniques to inspect wafers for defects and anomalies. The advantages of this testing technology include the ability to detect very small defects, to achieve a high sensitivity to manufacturing defects, and to provide a comprehensive diagnostic report of the wafer.

The application field of P716B-WAFER-TESTED technology is quite broad, as it can be used for a variety of purposes such as quality control, prototyping, failure analysis, and process optimization. It is ideal for the inspection of silicon wafers, as well as GaN, Ge, AlN, and SiC substrates. This technology can also be used in conjunction with other testing methods such as acoustic emission, X-ray diffraction, and scanning electron microscopy.

The working principle of P716B-WAFER-TESTED is based on vision imaging and eddy current inspection. During the vision system inspection, the wafer is examined by an advanced camera system. The camera system is able to detect very small defects by having optical properties such as spectral range and polarization. After the vision system inspection is complete, the wafer is inspected using eddy current testing. In this process, the wafer’s surface is scanned by an eddy current detector. The eddy current detector is able to detect the presence of any kinds of defects and anomalies such as cracks, voids, and warps.

P716B-WAFER-TESTED can be used for the inspection and testing of various kinds of wafers and substrates. It is an ideal technology for detecting very small defects and anomalies, and it can provide a comprehensive report of the wafer’s condition and quality. Furthermore, this technology is compatible with other testing methods and can be used for a variety of purposes such as quality control and process optimization.