QB0302B20ESS3 Allicdata Electronics
Allicdata Part #:

QB0302B20ESS3-ND

Manufacturer Part#:

QB0302B20ESS3

Price: $ 3.69
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For 0302 Package
DataSheet: QB0302B20ESS3 datasheetQB0302B20ESS3 Datasheet/PDF
Quantity: 1000
25 +: $ 3.35941
Stock 1000Can Ship Immediately
$ 3.69
Specifications
Series: Q-Bridge
Part Status: Active
Accessory Type: Heat Director/Transfer
For Use With/Related Products: 0302 Package
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

QB0302B20ESS3 application field and working principle

Thermal - Heat Sinks

Heat sinks are devices that are designed to dissipate heat away from sensitive electronics and other machinery. They often take the form of metal plates, fins, or other geometric shapes mounted on top of a thermally conductive interface material such as thermal paste. QB0302B20ESS3 heat sinks are designed to specifically improve the heat dissipation for a particular application.

Application Field

QB0302B20ESS3 heat sinks are designed for a wide variety of applications. They are often used in industrial automation and control systems, power supplies, electronic components, and computer components. They are also used in automotive applications, consumer electronics, and many other technological applications.

Working Principle

QB0302B20ESS3 heat sinks work by dissipating heat away from electronic components, machinery, or other sensitive parts. The heat is dissipated by thermal conduction or convection. Thermal conduction is the direct transfer of heat from one object to another through a conductive material. Heat is conducted via materials such as aluminum or copper, which are highly conductive. Convection is the transfer of heat through the movement of liquid or gas.

QB0302B20ESS3 heat sinks are designed to maximize heat dissipation. To do this, they often utilize thin metal plates or multiple fins to increase the exposed surface area. The increased surface area increases the amount of air contact with the sink, and thus increases the heat dissipation rate. The fins also create air channels that allow for more air to flow across the entire surface of the sink. This further increases the heat dissipation rate.

QB0302B20ESS3 heat sinks are also designed to be as lightweight as possible while still providing a thermally efficient design. This is important since the weight of a heat sink can contribute to the overall heat dissipation rate. If the sink is too heavy, it can limit the amount of air that is able to flow around it. Additionally, lighter weight heat sinks allow for easier installation and use in a variety of applications.

Conclusion

QB0302B20ESS3 heat sinks are designed to provide a thermally efficient design for a variety of applications. They are designed to maximize heat dissipation through the use of multiple fins or thin metal plates. Additionally, they are designed to be as lightweight as possible in order to maximize air flow and minimize installation difficulty. They are a great choice for improving heat dissipation in electronics, industrial automation and control systems, power supplies, consumer electronics, and other applications.

The specific data is subject to PDF, and the above content is for reference

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