QB0603B25ESC7 Allicdata Electronics
Allicdata Part #:

QB0603B25ESC7-ND

Manufacturer Part#:

QB0603B25ESC7

Price: $ 3.21
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For 0603 Package
DataSheet: QB0603B25ESC7 datasheetQB0603B25ESC7 Datasheet/PDF
Quantity: 1000
100 +: $ 2.91375
Stock 1000Can Ship Immediately
$ 3.21
Specifications
Series: Q-Bridge
Part Status: Active
Accessory Type: Heat Director/Transfer
For Use With/Related Products: 0603 Package
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important component in modern technology. It ensures that components, circuits, systems and machines do not overheat, preventing costly damage and downtime, as well as maximizing the hardware’s performance. The QB0603B25ESC7 is a reliable and cost-effective thermal heat sink, which provides efficient heat transfer and dissipation for applications requiring a minimum of airflow and space.

The QB0603B25ESC7 is a heat sink designed to dissipate heat from components or devices. It is suitable for electrics, hot electronics components and components generating high temperatures. It is made of a rugged and durable aluminum material, and is available in a variety of sizes, materials, and finishes for a variety of applications. The QB0603B25ESC7 also features a unique design for optimal heat transfer and dissipation, with an optimal thermal resistance.

The QB0603B25ESC7 can be used in a wide variety of applications, from consumer electronics and medical devices to automotive and industrial electronics. It is perfect for use in applications requiring low airflow and a small footprint, such as laptops and tablets. The heat sink is particularly useful for applications with limited airflow, as it improves overall system performance and reliability. It is also suitable for applications requiring efficient cooling with larger components and higher temperatures.

The heat sink utilizes the natural convection, radiation and conduction of heat to provide efficient thermal transfer and dissipation. The aluminum fan blades draw in outside air and direct it across the heat sink, cooling the component it is attached to. As the air passes over the fins, the heat is dissipated away from the component. The fins are arranged in a spaced array to ensure maximum air circulation and heat dissipation. The fan also helps to reduce turbulence caused by the air passing over the fins.

The heat sink is easy to install and does not require any special tools. It can be fixed to the component or device using standard mechanical fasteners. The QB0603B25ESC7 features a special mounting system, which ensures that it is securely mounted to the component. The fan is also easy to maintain and service, with a long-life expectancy and low cost of ownership.

The QB0603B25ESC7 is an effective and reliable thermal heat sink, ideal for applications that require minimal space and efficient heat transfer and dissipation. Its rugged aluminum construction, efficient airflow design, and easy installation make it a perfect choice for a variety of applications, from laptops and tablets to industrial electronics and high-temperature components.

The specific data is subject to PDF, and the above content is for reference

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