Allicdata Part #: | R5F100FGAFP#X0-ND |
Manufacturer Part#: |
R5F100FGAFP#X0 |
Price: | $ 2.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Renesas Electronics America |
Short Description: | IC MCU 16BIT 128KB FLASH 44LQFPRL78 RL78/G13 Micro... |
More Detail: | N/A |
DataSheet: | R5F100FGAFP#X0 Datasheet/PDF |
Quantity: | 8824 |
1 +: | $ 2.00000 |
10 +: | $ 1.90000 |
50 +: | $ 1.85000 |
100 +: | $ 1.75000 |
500 +: | $ 1.55000 |
1000 +: | $ 1.40000 |
Series: | RL78/G13 |
Packaging: | Tape & Reel (TR) |
Part Status: | Discontinued at Digi-Key |
Applications: | -- |
Core Processor: | RL78 |
Core Size: | 16-Bit |
Speed: | 32MHz |
Controller Series: | -- |
Connectivity: | CSI, I²C, LINbus, UART/USART |
Peripherals: | DMA, LVD, POR, PWM, WDT |
Interface: | CSI, I2C, LIN, UART |
Number of I/O: | 31 |
Program Memory Size: | 128KB (128K x 8) |
Voltage - Supply: | 1.6V ~ 5.5V |
Program Memory Type: | FLASH |
EEPROM Size: | 8K x 8 |
Mounting Type: | Surface Mount |
RAM Size: | 12K x 8 |
Voltage - Supply (Vcc/Vdd): | 1.6 V ~ 5.5 V |
Data Converters: | A/D 10x8/10b |
Oscillator Type: | Internal |
Operating Temperature: | -40°C ~ 85°C (TA) |
Package / Case: | 44-LQFP |
Supplier Device Package: | 44-LQFP (10x10) |
Base Part Number: | R5F100 |
Total current flowing into VDD, EVDD0, and EVDD1, including the input leakage current flowing when the level of the input pin is fixed to VDD, EVDD0, and EVDD1, orVSS, EVSS0, and EVSS1. The values below the MAX. column include the peripheral operation current . However, not including the current flowing into the A/Dconverter,LVDcircuit, I/O port, and on-chip pull-up/pull-down resistors and the current flowing during data flash rewrite.
Ultra-low power consumption technology
1. VDD = single power supply voltage of 1.6 to 5.5 V
RL78 CPU core
1. CISC architecture with 3-stage pipeline
2. Minimum instruction execution time: Can be changed from high speed (0.03125 μs: @ 32 MHz operation with high-speed on-chip oscillator) to ultra-low speed
(30.5 μs: @ 32.768 kHz operation with subsystem clock)
3. Address space: 1 MB
4. General-purpose registers: (8-bit register × 8) × 4banks
5. On-chip RAM: 2 to 32 KB
Code flash memory
1. Code flash memory: 16 to 512 KB
2. Block size: 1 KB
3. Prohibition of block erase and rewriting (security function)
4. On-chip debug function
5. Self-programming (with boot swap function/flash shield window function)
Data Flash Memory
1. Data flash memory: 4 KB to 8 KB
2. Back ground operation (BGO): Instructions can be executed from the program memory while rewriting the data flash memory.
3. Number of rewrites: 1,000,000 times (TYP.)
4. Voltage of rewrites: VDD = 1.8 to 5.5 V
High-speed on-chip oscillator
1. Select from 32 MHz, 24 MHz, 16 MHz, 12 MHz, 8 MHz,6 MHz, 4 MHz, 3 MHz, 2 MHz, and 1 MHz
2. High accuracy: +/- 1.0 % (VDD = 1.8 to 5.5 V, TA = -20to +85°C)
Operating ambient temperature
1. TA = -40 to +85°C (A: Consumer applications, D: Industrial applications )
2. TA = -40 to +105°C (G: Industrial applications) Power management and reset function
3. On-chip power-on-reset (POR) circuit
4. On-chip voltage detector (LVD) (Select interrupt and reset from 14 levels)
DMA (Direct Memory Access) controller
1. 2/4 channels
2. Number of clocks during transfer between 8/16-bit SFR and internal RAM: 2 clocks
Serial interface
1. CSI: 2 to 8 channels
2. UART/UART (LIN-bus supported): 2 to 4 channels
3. I2C/Simplified I2C communication: 3 to 10 channels
Timer
1. 16-bit timer: 8 to 16 channels
2. 12-bit interval timer: 1 channel
3. Real-time clock: 1 channel (calendar for 99 years,alarm function, and clock correction function)
4. Watchdog timer: 1 channel (operable with the dedicated low-speed on-chip oscillator)
A/D converter
1. 8/10-bit resolution A/D converter (VDD = 1.6 to 5.5 V)
2. Analog input: 6 to 26 channels
3. Internal reference voltage (1.45 V) and temperature sensor Note 1
I/O port
1. I/O port: 16 to 120 (N-ch open drain I/O [withstand voltage of 6 V]: 0 to 4, N-ch open drain I/O[VDD withstand voltage Note 2/EVDD withstand voltage Note 3]: 5 to 25)
2. Can be set to N-ch open drain, TTL input buffer, and on-chip pull-up resistor
3. Different potential interface: Can connect to a 1.8/2.5/3
V device
1. On-chip key interrupt function
2. On-chip clock output/buzzer output controller
Others
1. On-chip BCD (binary-coded decimal) correction circuit
Remarks
1. fMX: High-speed system clock frequency (X1 clock oscillation frequency or external main system clock frequency)
2. fIH: High-speed on-chip oscillator clock frequency
3. fSUB: Subsystem clock frequency (XT1 clock oscillation frequency)
4. Except subsystem clock operation and STOP mode, temperature condition of the TYP. value is TA = 25°C
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