RUR671U Allicdata Electronics
Allicdata Part #:

294-1002-ND

Manufacturer Part#:

RUR671U

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK PRESSON PANEL MNT TO-92
More Detail: Heat Sink TO-92 Brass
DataSheet: RUR671U datasheetRUR671U Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Part Status: Obsolete
Type: --
Package Cooled: TO-92
Attachment Method: Press Fit
Shape: --
Length: --
Width: --
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Brass
Material Finish: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermoelectric Coolers (TECs) are heat pumps that can be used to transfer heat from one side to the other. The most common application of TECs is cooling, but they can also be used to generate power by using the Seebeck effect. RUR671U is a high-performance TEC module designed for cooling and heating applications from -50°C to 200°C.

The RUR671U can be used for a variety of applications including cooling of electronics and components, cooling of LCD displays, cooling of laser diodes, temperature stabilization, and thermal cycling. It is designed for use in harsh environmental conditions, and is highly resistant to shock and vibration.

Thermal- Heat Sinks

RUR671U TEC modules are used in combination with heat sinks for efficient heat-sinking and transfer of heat from the TEC to the ambient environment. The heat-sink of the RUR671U consists of highly conductive aluminum, which helps to dissipate the heat over a large area. This process ensures that the TEC maintains stability and efficiency of cooling. The material used in the manufacturing of the heat-sink is designed for high pressure, and the design includes a special coating to increase the efficiency of the heat-sink and reduce the resistance to heat transfer.

The heat-sink of the RUR671U can be customized according to user requirements. This helps to reduce the thermal resistance, and results in more efficient heat transfer from the TEC to the environment. In addition, the heat-sink can be optimized for specific applications, such as high-power radiating applications where the thermal resistance is the primary consideration.

Working Principle

The working principle of the RUR671U module is based on the Seebeck effect. In this process, when a temperature difference exists between two different materials, a voltage is generated which in turn generates an electric current. As the TEC module is heated, the differences in temperatures cause an electric current to be generated. The electric current is then used to resistively cool the TEC module. This results in a temperature decrease in the TEC, which in turn creates a difference in temperatures between the input and output leads of the TEC module.

The electric current generated by the module is used to resistively cool the TEC module, and this results in the transfer of heat from the source to the target. The heat sink of the RUR671U helps in dissipating the heat over a large area, so that the TEC module maintains its stability and efficiency of cooling. Once the desired output temperature is reached, the process is reversed, and the TEC module will start to heat up again.

The RUR671U is designed to provide a highly efficient, reliable and durable cooling solution. Its optimized design and high-performance construction ensure its reliability even under the harshest environmental conditions.

The specific data is subject to PDF, and the above content is for reference

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