SA000-12009

Series:	--
Part Status:	Active
Type:	Top Mount
Package Cooled:	--
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	--

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Thermal - Heat Sinks

Heat sinks are devices designed to dissipate thermal energy from a component or system. They work by providing a large area of contact between the hot component and the external environment, allowing the heat to flow away from the component and to be dispersed in the atmosphere. Heat sinks are very important components of any electronic device or appliance, and are used in a variety of applications ranging from audio/video systems to small consumer electronics and computers.The SA000-12009 heat sink is one of the most popular and highly efficient thermal management solutions on the market today. The product is manufactured from extruded aluminum and is designed for use in consumer electronics and other applications requiring effective and reliable heat dissipation. The product is available in multiple sizes and also provides optional mounting features for those who need to mount the product securely to a chassis or other mounting points.The SA000-12009 heat sink utilizes a combination of two different thermal management technologies in order to achieve its high level of effectiveness. The first is a special fin structure that increases the contact surface area of the heat sink, aiding in the dissipation of thermal energy as the component or device produces it. The other technology is an optimized air flow design, which ensures that air circulates through the fins of the heat sink in a uniform manner. This helps to dissipate heat more quickly and helps to prevent areas of the component from experiencing excess heat buildup.In addition to the fin design and air flow technology, the SA000-12009 heat sink also features a thermal resistance range of between 0.45 and 0.55 C/W. This relatively low thermal resistance means that the product can efficiently dissipate heat from a wide range of components and devices, regardless of how powerful or thermally sensitive the devices are. By providing an optimal thermal management solution at a relatively low cost, the SA000-12009 is ideal for desktop PCs, laptops and other computing applications.The SA000-12009 is also unique in that it is compatible with a range of different mounting methods, from screw type mounting to press-fit type mounting solutions. This makes it ideal for different mounting points and ensures that it can be securely mounted to provide the best possible thermal performance. As such, the product is highly recommended for computers, servers and other mobile computing applications.In conclusion, the SA000-12009 is a reliable and highly effective thermal management solution that is well suited to a range of applications. Its special fin design and air flow technology result in optimal heat dissipation, while its low cost and diverse mounting options make it ideal for both consumer electronics and desktop PCs alike. With its high level of effectiveness, the SA000-12009 is an ideal choice for anyone looking for an efficient and reliable heat sink solution.

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Part Number	Manufacturer	Price	Quantity	Description