SE97TK,118 Allicdata Electronics

SE97TK,118 Integrated Circuits (ICs)

Allicdata Part #:

568-4292-2-ND

Manufacturer Part#:

SE97TK,118

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: NXP USA Inc
Short Description: IC TEMP SENSOR DIMM 8-HVSON
More Detail: Temp Monitoring System (Sensor), DIMM DDR Memory -...
DataSheet: SE97TK,118 datasheetSE97TK,118 Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Topology: ADC (Sigma Delta), Comparator, Register Bank
Base Part Number: SE97
Supplier Device Package: 8-HVSON (3x3)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3 V ~ 3.6 V
Output Fan: Yes
Output Alarm: Yes
Output Type: I²C/SMBus
Series: --
Accuracy: ±3°C(Max)
Sensing Temperature: -40°C ~ 125°C
Sensor Type: Internal
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Moisture Sensitivity Level (MSL): --
Part Status: Obsolete
Lead Free Status / RoHS Status: --
Packaging: Tape & Reel (TR) 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

SE97TK is a highly integrated and low-power PMIC - Thermal Management device that provides an intelligent solution for thermal management applications. It features a unique power conversion system, and integrated thermal sensors, allowing it to accurately monitor and control the temperature of the system with minimal power consumption. The device provides efficient thermal management solutions for a variety of applications including computers, servers, industrial equipment, and other embedded systems.

The SE97TK is a highly integrated single-chip solution that integrates a variety of popular PMIC - Thermal Management components, including a pair of thermal sensors, thermal monitoring and control circuitry, power management and over-temperature protection structures. It uses a combination of infrared and contactless technologies to accurately detect and measure average temperatures across an entire device. The device also monitors and manages thermal energy dissipation and distribution, dynamically reduces local temperature areas, and supports temperature control, over-temperature protection, and active cooling.

The SE97TK is designed for use in a wide range of applications, from small to large-scale systems. It is ideal for servers and other high-power systems that require reliable performance and thermal management. The SE97TK provides several features that make it an attractive choice for embedded and industrial applications. The integrated voltage regulator ensures reliable operation of the system while the dual thermal sensor monitors and adjusts the thermal environment, ensuring the safety and stability of the system.

The SE97TK also provides a powerful thermal management solution that is designed to reduce thermal runaway, handle large transient thermal loads, and manage local temperature hotspots. To prevent thermal runaway, the device utilizes an adaptive power management structure that can automatically adjust the temperature depending on the system load. It also includes an over-temperature protection structure that can detect and manage excessive temperatures quickly, before it causes damage to the system. Last, the integrated thermal sensor allows it to accurately detect and measure local temperature hotspots and dynamically adjust the local temperature to keep it within acceptable levels.

The SE97TK is capable of providing a highly efficient and reliable thermal management solution in a variety of applications. Its ability to accurately detect and manage system temperature and its powerful thermal management features provide an unparalleled level of control and monitoring. With its low power consumption and small footprint, the SE97TK is an ideal solution for embedded and industrial applications and is an excellent choice for thermal management applications.

The specific data is subject to PDF, and the above content is for reference

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