| Allicdata Part #: | SEN06464E1CG1SA-30R-ND |
| Manufacturer Part#: |
SEN06464E1CG1SA-30R |
| Price: | $ 0.00 |
| Product Category: | Memory Cards, Modules |
| Manufacturer: | Swissbit |
| Short Description: | MOD DDR2 SDRAM 512MB 200SODIMM |
| More Detail: | Memory Module DDR2 SDRAM 512MB 667MT/s 200-SODIMM |
| DataSheet: | SEN06464E1CG1SA-30R Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | 0.00000 |
Specifications
| Series: | -- |
| Part Status: | Obsolete |
| Memory Type: | DDR2 SDRAM |
| Memory Size: | 512MB |
| Speed: | 667MT/s |
| Package / Case: | 200-SODIMM |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
SEN06464E1CG1SA-30R Memory Module Application Field and Working PrincipleThe SEN06464E1CG1SA-30R memory module is an industrial grade high-speed dynamic random access memory (DRAM). It is designed to provide industry leading performance and reliability in a wide range of embedded systems. The module is ideal for use in industrial control systems, medical imaging, military and aerospace systems, and any other application requiring a powerful, reliable and cost-effective memory solution.The SEN06464E1CG1SA-30R is a dual in-line memory module (DIMM) featuring two ranks of 512-megabit (Mb) DRAMs operating at 1.35 volts (V) with industry-standard E1CG1SA-30R memory chips. It is a high-performance, low-power DRAM designed for applications requiring high throughput, low latency, and high reliability. Its small form factor and high-density make it ideal for small form factor motherboards and systems such as embedded controllers and servers. The module\'s performance is also enhanced by its industry-standard error correction code (ECC) architecture, which helps to ensure data integrity in mission-critical applications.The SEN06464E1CG1SA-30R module is comprised of two architectures, both of which are designed to offer superior performance and reliability. The first is a proprietary single rank architecture with two stacked dynamic banks for increased speed and improved thermal performance. The second is a dual bank architecture, which features a static bank and a dynamic bank for improved energy efficiency and thermal performance.To ensure optimal performance, the SEN06464E1CG1SA-30R memory module features an advanced error-correction code (ECC). This ECC is designed to detect and correct single-bit errors and correct two-bit errors in real-time, allowing the device to achieve maximum data transfer rate performance. Additionally, the module incorporates a wear-leveling algorithm that allows the ECC to effectively store and retrieve data, increasing the module\'s longevity and reliability.Furthermore, the SEN06464E1CG1SA-30R features an on-board temperature sensor, which allows the system to monitor the temperature of the module and adjust thermal management accordingly. This allows the module to achieve optimal performance even in extreme temperatures.In conclusion, the SEN06464E1CG1SA-30R memory module is a high-performance, low-power, and cost-effective option for embedded systems and applications requiring high throughput, low latency, and high reliability. The module\'s dual in-line architecture and advanced ECC technologies work together to provide superior performance and reliability, while its on-board temperature sensor ensures that the module function safely even in extreme temperatures.The specific data is subject to PDF, and the above content is for reference
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SEN06464E1CG1SA-30R Datasheet/PDF