SN65LVDS151DA Allicdata Electronics
Allicdata Part #:

296-9738-5-ND

Manufacturer Part#:

SN65LVDS151DA

Price: $ 6.76
Product Category:

Integrated Circuits (ICs)

Manufacturer: Texas Instruments
Short Description: IC MUX SER TRANSMITTER 32-TSSOP
More Detail: 200Mbps Serializer 10 Input 3 Output 32-TSSOP
DataSheet: SN65LVDS151DA datasheetSN65LVDS151DA Datasheet/PDF
Quantity: 63
1 +: $ 6.14250
10 +: $ 5.54778
100 +: $ 4.59327
500 +: $ 3.99974
1000 +: $ 3.48365
Stock 63Can Ship Immediately
$ 6.76
Specifications
Series: --
Packaging: Tube 
Part Status: Active
Function: Serializer
Data Rate: 200Mbps
Input Type: LVDS, LVTTL
Output Type: LVDS
Number of Inputs: 10
Number of Outputs: 3
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-TSSOP (0.240", 6.10mm Width)
Supplier Device Package: 32-TSSOP
Base Part Number: SN65LVDS151
Description

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SN65LVDS151DA, manufactured by Texas Instruments, is a low-voltage differential signal pair (LVDS) driver/receiver. It is a type of interface solution in the category of Serializers, Deserializers. It supports data transfer rate up to 266 Mbps and provides industry-standard output voltage level. As a industry standard solution, the SN65LVDS151DA is a plug-and-play option for interface designs.

Designed with space and powerefficiency in mind, the SN65LVDS151DA features excellent signal integrity and signal translation. Its small size allows for flexible applications, and its low power consumption makes it ideal for applications that require high performance with low power consumption, such as battery powered products or energy efficient servers.The SN65LVDS151DA also features a wide common-mode range operating temperature; the wide range of operation enables the circuit to compensate for noisy environment and to operate in special environmental conditions which normally require special design techniques.

SN65LVDS151DA is easy to use and can be connected directly to existing systems. It converts input signals, multiplexer data, regeneration and clock signals into differential signal pairs, and changes it back on the receiving side as well to ensure proper signal transmission. The SN65LVDS151DA can be used in a variety of applications such as High Definition (HD) video, point-to-point communication, data synchronization and clock synchronization, server and storage connection, satellite communications, and telemetry.

As one of the most popular IC in its field, the SN65LVDS151DA has an average propagation delay of only 5ns, stands beyond its competitors. Its small size and wide operating temperature range makes it an ideal choice for mobile and wireless application. The low powerdraw combined with smaller size makes it an attractive option for various industrial and automotive application.

Moreover, the"Hot Swap" principle which is implemented in this device enables it to be used in large-scale distributed systems without a power reset when replacing a component. This is an important factor in applications that require reliable communication with no disruption, such as satellite data transfer or security systems.

SN65LVDS151DA is also largely compatible with industry standard LVDS. It supports Electrical Industries Association Standard EIA-644, and transmits data signals over a pair of differential wires. The data signals are transmitted through a differential pair in Order-Star format. The differential signals are used to provide more reliable data transmission. The SN65LVDS151DA also supports the popular LVDS high-speed link, a point-to-point link for serial transmission applications, as well as DDR-SDRAM Memory Interface for applications such as Video Memories and Frame Buffer Controllers (FBCs).

The SN65LVDS151DA has a high level of integration, and its features make it an ideal choice for a variety of interface solutions. It can be used in a variety of serializer, deserializer, synchronous interface communication system and embedded systems. The SN65LVDS151DA is available in two standard package options: the SOIC (Small Outline Integrated Circuit) package and the TSSOP (Thin Shrink Small Outline Package). This makes the IC suitable for a variety of applications and embedded projects.

The specific data is subject to PDF, and the above content is for reference

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