STM32F103RGT7

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1. Describe

The STM32F103xF and STM32F103RGT7 performance families include a high-performance ARM® Cortex®-M3 32-bit RISC core running at 72 MHz, high-speed embedded memory, and various enhanced I/O and peripherals connected to two APB buses. All devices offer three 12-bit ADCs, ten general-purpose 16-bit timers, and two PWM timers, as well as standard and advanced communication interfaces: up to two I2C, three SPI, two I2Ss, one SDIO, five USART, one USB and one CAN. The STM32F103xF/G XL density performance family has an operating temperature range of –40 to +105 °C from a 2.0 to 3.6 V supply. A comprehensive set of power-saving modes allows the design of low-power applications.

2. Features

    1. Core: ARM® 32-bit Cortex®-M3 CPU with MPU

        – 72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access

        – Single-cycle multiplication and hardware division

    2. Memories

        – 768 Kbytes to 1 Mbyte of Flash memory

        – 96 Kbytes of SRAM

        – Flexible static memory controller with 4 Chip Select. Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories

        – LCD parallel interface, 8080/6800 modes

    3. Clock, reset and supply management

        – 2.0 to 3.6 V application supply and I/Os

        – POR, PDR, and programmable voltage detector (PVD)

        – 4-to-16 MHz crystal oscillator

        – Internal 8 MHz factory-trimmed RC

        – Internal 40 kHz RC with calibration

        – 32 kHz oscillator for RTC with calibration

    4. Low power

        – Sleep, Stop and Standby modes

        – VBAT supply for RTC and backup registers

    5. 3 × 12-bit, 1 µs A/D converters (up to 21 channels)

        – Conversion range: 0 to 3.6 V

        – Triple-sample and hold capability

        – Temperature sensor

    6. 2 × 12-bit D/A converters

    7. DMA: 12-channel DMA controller

        – Supported peripherals: timers, ADCs, DAC, SDIO, I2Ss, SPIs, I2Cs and USARTs

    8. Debug mode

        – Serial wire debug (SWD) & JTAG interfaces

        – Cortex®-M3 Embedded Trace Macrocell™

    9. Up to 112 fast I/O ports

        – 51/80/112 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant

  10. Up to 17 timers

        – Up to ten 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input

        – 2 × 16-bit motor control PWM timers with dead-time generation and emergency stop

        – 2 × watchdog timers (Independent and Window)

        – SysTick timer: a 24-bit downcounter

        – 2 × 16-bit basic timers to drive the DAC

  11. Up to 13 communication interfaces

        – Up to 2 × I2C interfaces (SMBus/PMBus)

        – Up to 5 USARTs (ISO 7816 interface, LIN, IrDA capability, modem control)

        – Up to 3 SPIs (18 Mbit/s), 2 with I2S interface multiplexed

        – CAN interface (2.0B Active)

        – USB 2.0 full speed interface

        – SDIO interface

  12. CRC calculation unit, 96-bit unique ID

  13. ECOPACK® packages

3. Application

    1. motor driven

    2. application control

    3. Medical and Handheld Devices

    4. PC and Gaming Peripherals

    5. GPS platform

    6. Industrial application

    7. PLC

    8. Inverter

    9. printer

  10. scanner

  11. Alarm system and video intercom

4. Full compatibility

The STM32F103xF/G is a complete family with members completely pin-to-pin, software and functionally compatible. In the reference manual, STM32F103x4 and STM32F103x6 are are identified as low density devices, STM32F103x8 and STM32F103xB are called Medium density devices, STM32F103xF, STM32F103xD and STM32F103xG Yes STM32F103xF and STM32F103xG are known as High Density Device XL density devices. Low-density, high-density and XL density devices are extensions of the STM32F103x8/B medium-density devices, they are specified in the STM32F103x4/6, STM32F103xC/D/E and STM32F103xF/G datasheets, respectively. Low-density devices have lower Flash memory and RAM capacity, and fewer timers and peripherals. High-density devices have higher flash and RAM capacities, as well as additional peripherals such as SDIO, FSMC, I2S, and digital-to-analog converters. XL density devices bring more flash and RAM memory, plus extra features, Namely an MPU, more timers and a dual bank flash structure, while remaining fully compatible with the rest of the family. The STM32F103x4, STM32F103x6, STM32F103xF, STM32F103xD, STM32F103xG, STM32F103xF and STM32F103xG are drop-in replacement devices for the STM32F103x8/B, allowing users to experiment with different memory densities and providing a greater degree of freedom in the development cycle. In addition, the STM32F103xx performance family is fully compatible with all existing STM32F101xx access line and STM32F102xx USB access line devices.