STM32F103VET6

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1. Describe

The STM32F103xC, STM32F103xD and STM32F103VET6 performance families include a high-performance Arm® Cortex®-M3 32-bit RISC core running at 72 MHz, high-speed embedded memory (up to 512 KB Flash and up to 64 KB SRAM) and a wide range of enhanced I/O and Peripherals are connected to both APB buses. All devices offer three 12-bit ADCs, four general-purpose 16-bit timers, and two PWM timers, as well as standard and advanced communication interfaces: up to two I2C, three SPI, two I2S, one SDIO, five USARTs , one USB and one can be used. The STM32F103xC/D/E high-density performance series has an operating temperature range of –40 to +105°C and a supply voltage of 2.0 to 3.6 V. A comprehensive set of power-saving modes allows the design of low-power applications. These features make the STM32F103xC/D/E high-density performance series microcontroller family suitable for a wide range of applications.

2. Feature

    1. Core: Arm® 32-bit Cortex®-M3 CPU

        – 72 MHz max frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access

        – Single-cycle multiply and hardware divide

    2. remember

        – 256 to 512 KB of flash memory

        – Up to 64 KB of SRAM

        – Flexible static memory controller with 4 chip selects. Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories

        – LCD parallel interface, 8080/6800 mode

    3. Clock, reset and power management

        – 2.0 to 3.6 V application power and I/O

        – POR, PDR and Programmable Voltage Detector (PVD)

        – 4 to 16 MHz crystal oscillator

        – Internal 8 MHz factory trimmed RC

        – Internal 40 kHz RC with calibration

        – 32 kHz oscillator for RTC with calibration

    4. low power

        – Sleep, Stop and Standby modes

        – VBAT power supply for RTC and backup registers

    5. 3 × 12-bit, 1 µs A/D converters (up to 21 channels)

        – Conversion range: 0 to 3.6 V

        – Triple sample and hold capability

        – temperature sensor

    6. 2 × 12-bit D/A converters

    7. DMA: 12-channel DMA controller

        – Peripherals supported: Timer, ADC, DAC, SDIO, I2S, SPI, I2C and USART

    8. Debug mode

        – Serial Wire Debug (SWD) and JTAG interface

        – Cortex®-M3 Embedded Trace Macrocell™

    9. Up to 112 fast I/O ports

        – 51/80/112 I/Os, all mappable to 16 external interrupt vectors, almost all 5 V tolerant

  10. Up to 11 timers

        – Up to four 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder inputs

        – Two 16-bit motor control PWM timers with dead time generation and emergency stop

        – 2 × watchdog timers (independent and windowed)

        – SysTick timer: a 24-bit down counter

        – Two 16-bit basic timers for driving DAC

  11. Up to 13 communication ports

        – Up to 2 I2C interfaces (SMBus/PMBus)

        – Up to 5 USARTs (ISO 7816 interface, LIN, IrDA function, modem control)

        – Up to 3 SPIs (18 Mbit/s), 2 with multiplexed I2S interface

        – CAN interface (2.0B active)

        – USB 2.0 full speed interface

        – SDIO interface

  12. CRC calculation unit, 96-bit unique ID

  13. ECOPACK® packaging

3. Pin configuration

4. Application

    1. motor driven

    2. application control

    3. Medical and Handheld Devices

    4. Computer and Gaming Peripherals

    5. GPS platform

    6. Industrial application

    7. programmable logic controller

    8. Inverter

    9. printer

  10. scanner

  11. Alarm System Video Intercom HVAC

5. STM32F103VET6 full compatibility

The STM32F103VET6 is a complete family whose members are fully pin-to-pin, software and function compatible. STM32F103x4 and STM32F103x6 are identified as low- density devices, STM32F103x8 and STM32F103xB as medium-density devices, and STM32F103xC, STM32F103xD and STM32F103xE as high-density devices. The low-density and high-density devices are extensions of the STM32F103x8/B medium-density devices, which are specified in the STM32F103x4/6 and STM32F103xC/D/E datasheets, respectively. Low-density devices have lower flash and RAM capacity, fewer timers and peripherals. High-density devices feature higher flash and RAM capacities, as well as additional peripherals such as SDIO, FSMC, I2S, and DAC, while being fully compatible with other members of the family. The STM32F103x4, STM32F103x6, STM32F103xC, STM32F103xD and STM32F103xE are drop-in replacements for the STM32F103x8/B devices, allowing users to experiment with different memory densities and providing more freedom in the development cycle. In addition, the STM32F103xx performance family is fully compatible with all existing STM32F101xx access line and STM32F102xx USB access line devices.