STM32L151CBU6A

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1. Description

The ultra-low-power STM32L151CBU6A B-A and STM32L152x6/8/B-A devices incorporate the connectivity power of the universal serial bus (USB) with the high-performance ARM® Cortex®-M3 32-bit RISC core operating at a frequency of 32 MHz (33.3 DMIPS), a memory protection unit (MPU), high-speed embedded memories (Flash memory up to 128 Kbytes and RAM up to 32 Kbytes) and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All the devices offer a 12-bit ADC, 2 DACs and 2 ultra-low-power comparators, six generalpurpose 16-bit timers and two basic timers, which can be used as time bases. Moreover, the STM32L151x6/8/B-A and STM32L152x6/8/B-A devices contain standard and advanced communication interfaces: up to two I2Cs and SPIs, three USARTs and a USB. The STM32L151x6/8/B-A and STM32L152x6/8/B-A devices offer up to 20 capacitive sensing channels to simply add touch sensing functionality to any application. They also include a real-time clock with sub-second counting and a set of backup registers that remain powered in Standby mode. Finally, the integrated LCD controller (except STM32L151x6/8/B-A devices) has a built-in LCD voltage generator that allows to drive up to 8 multiplexed LCDs with contrast independent of the supply voltage. The ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A devices operate from a 1.8 to 3.6 V power supply (down to 1.65 V at power down) with BOR and from a 1.65 to 3.6 V power supply without BOR option. They are available in the -40 to +85 °C and -40 to +105°C temperature ranges. A comprehensive set of power-saving modes allows the design of low-power applications.

2. Features

    1. Ultra-low-power platform

        – 1.65 V to 3.6 V power supply

        – -40°C to 105°C temperature range

        – 0.28 µA Standby mode (3 wakeup pins)

        – 1.11 µA Standby mode + RTC

        – 0.44 µA Stop mode (16 wakeup lines)

        – 1.38 µA Stop mode + RTC

        – 10.9 µA Low-power Run mode

        – 185 µA/MHz Run mode

        – 10 nA ultra-low I/O leakage

        – < 8 µs wakeup time

    2. Core: ARM® Cortex®-M3 32-bit CPU

        – From 32 kHz up to 32 MHz max

        – 1.25 DMIPS/MHz (Dhrystone 2.1)

        – Memory protection unit

    3. Reset and supply management

        – Ultra-safe, low-power BOR (brownout reset) with 5 selectable thresholds

        – Ultra-low-power POR/PDR

        – Programmable voltage detector (PVD)

    4. Clock sources

        – 1 to 24 MHz crystal oscillator

        – 32 kHz oscillator for RTC with calibration

        – High Speed Internal 16 MHz factorytrimmed RC (+/- 1%)

        – Internal low-power 37 kHz RC

        – Internal multispeed low-power 65 kHz to 4.2 MHz

        – PLL for CPU clock and USB (48 MHz)

    5. Pre-programmed bootloader

        – USART supported

    6. Development support

        – Serial wire debug supported

        – JTAG and trace supported

    7. Up to 83 fast I/Os (73 I/Os 5V tolerant), all mappable on 16 external interrupt vectors

    8. Memories

        – Up to 128 Kbytes Flash memory with ECC

        – Up to 32 Kbytes RAM

        – Up to 4 Kbytes of true EEPROM with ECC

        – 80-byte backup register

    9. LCD Driver (except STM32L151x6/8/B-A devices) for up to 8x40 segments

        – Support contrast adjustment

        – Support blinking mode

        – Step-up converter on board

  10. Rich analog peripherals (down to 1.8 V)

        – 12-bit ADC 1 Msps up to 24 channels

        – 12-bit DAC 2 channels with output buffers

        – 2x ultra-low-power-comparators (window mode and wake up capability)

  11. DMA controller 7x channels

  12. 8x peripheral communication interfaces

        – 1x USB 2.0 (internal 48 MHz PLL)

        – 3x USART (ISO 7816, IrDA)

        – 2x SPI 16 Mbits/s

        – 2x I2C (SMBus/PMBus)

  13. 10x timers: 6x 16-bit with up to 4 IC/OC/PWM channels, 2x 16-bit basic timers, 2x watchdog timers (independent and window)

  14. Up to 20 capacitive sensing channels supporting touchkey, linear and rotary touch sensors

  15. CRC calculation unit, 96-bit unique ID

3. Pin configuration

4. Applications

    1. Medical and handheld equipment

    2. Application control and user interface

    3. PC peripherals, gaming, GPS and sport equipment

    4. Alarm systems, Wired and wireless sensors, Video intercom

    5. Utility metering

5. Function description

    1. Sleep mode

        In sleep mode, only the CPU is stopped. All peripherals continue to operate and can wake up the CPU on interrupts/events.

    2. Low power operation mode

        This mode is achieved by setting the Multi-Speed Internal (MSI) RC Oscillator to the MSI Range 0 or MSI Range 1 clock range (131 kHz maximum), executing from SRAM or Flash, and the internal regulator in a low power mode, to minimize the regulator's Working current. In low-power run modes, both the clock frequency and the number of enabled peripherals are limited.

    3. Low power sleep mode

        This mode is achieved by entering sleep mode when the internal regulator is in a low power mode to minimize the operating current of the regulator. In low-power sleep mode, both the clock frequency and the number of enabled peripherals are limited; a A typical example is having a timer running at 32 kHz. When a wake-up is triggered by an event or interrupt, the system reverts to run mode with the voltage regulator turned on.

    4. Stop mode with RTC

        stop mode for lowest power consumption while RAM and register contents and real-time clock. All clocks in the VCORE domain are stopped and the PLL, MSI RC, HSI RC and HSE crystal oscillators are disabled. The LSE or LSI is still running. The regulator is in low power mode. The device can wake-up from stop mode within 8 µs via any EXTI line. The EXTI line source can be one of 16 external lines. It can be PVD output, Comparator 1 event or Comparator 2 event, it can be RTC alarm, USB wakeup, RTC tamper event, RTC timestamp event or RTC wakeup

    5. Stop mode without RTC

        Stop mode achieves the lowest power consumption while preserving RAM and register contents. All clocks are stopped, PLL, MSI RC, HSI and LSI RC, LSE and HSE crystal oscillators are disabled. The regulator is in low power mode. The device can wake-up from stop mode within 8 µs via any EXTI line. The EXTI line source can be one of 16 external lines. It can be a PVD output, a Comparator 1 event, or a Comparator 2 event. It can also be woken up via USB wakeup.

    6. Standby mode with RTC

        Standby mode is used for lowest power consumption and real-time clock. The internal voltage regulator is turned off, thus shutting down the entire VCORE domain. The PLL, MSI RC, HSI RC and HSE crystal oscillators are also turned off. The LSE or LSI is still running. After entering standby mode, the RAM and registers Except for the registers in the standby circuit (wakeup logic, IWDG, RTC, LSI, LSE Crystal 32K osc, RCC_CSR), everything else is lost. When an external reset (NRST pin), IWDG reset, a rising edge on one of the three WKUP pins, an RTC alarm (alarm A or alarm B), an RTC tamper event, an RTC timestamp event, or an RTC wakeup event occurs.

    7. Standby mode without RTC

        Standby mode is used to achieve the lowest power consumption. The internal voltage regulator is turned off, thus shutting down the entire VCORE domain. PLL, MSI, RC, HSI and LSI RC, HSE and LSE crystal oscillators are also turned off. After entering standby mode, the contents of RAM and registers are lost, except that the registers are Standby circuit (wakeup logic, IWDG, RTC, LSI, LSE Crystal 32K osc, RCC_CSR).