STM32L476RGT6 Allicdata Electronics
Allicdata Part #:

497-15877-ND

Manufacturer Part#:

STM32L476RGT6

Price: $ 5.96
Product Category:

Integrated Circuits (ICs)

Manufacturer: STMicroelectronics
Short Description: IC MCU 32BIT 1MB FLASH 64LQFPARM® Cortex®-M4 STM32...
More Detail: N/A
DataSheet: STM32L476RGT6 datasheetSTM32L476RGT6 Datasheet/PDF
Quantity: 14496
1 +: $ 5.95980
10 +: $ 5.78101
100 +: $ 5.66181
1000 +: $ 5.54261
10000 +: $ 5.36382
Stock 14496Can Ship Immediately
$ 5.96
Specifications
Series: STM32L4
Packaging: Tray 
Part Status: Active
Applications: --
Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 80MHz
Controller Series: ARM Microcontrollers - MCU
Connectivity: CANbus, I²C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, SWPMI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, PWM, WDT
Interface: I2C,SAI, SPI
Number of I/O: 51
Program Memory Size: 1MB (1M x 8)
Voltage - Supply: 1.71 V ~ 3.6 V
Program Memory Type: FLASH
EEPROM Size: --
Mounting Type: Surface Mount
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 16x12b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)
Base Part Number: STM32L476
Description

Due to market price fluctuations,if you need to purchase or consult the price.You can contact us or emial to us:   sales@allicdata.com


1. Describe

The STM32L476RGT6 device is an ultra-low-power microcontroller based on a high-performance Arm® Cortex®-M4 32-bit RISC core operating at up to 80 MHz. The Cortex-M4 core features floating-point unit (FPU) single precision, supporting all Arm® single-precision data processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) for enhanced application security. STM32L476xx devices embed high-speed memory (up to 1 MB Flash, up to 128 KB SRAM), Flexible External Memory Controller (FSMC) for static memory (for devices with 100-pin and more packages), Quad SPI Flash interface (available on all packages) and various enhanced I/Os and peripherals connected to two APB buses, two AHB buses, and a 32-bit multi-AHB bus matrix. STM32L476xx devices embed several protection mechanisms for embedded flash and SRAM: read protection, write protection, proprietary code read protection and firewall. These devices provide up to three fast 12-bit ADCs (5 Msps), two comparators, two op amps, two DAC channels, an internal voltage reference buffer, a low power RTC, two general purpose 32-bit timing timer, two 16-bit PWM timers dedicated to motor control, seven general-purpose 16-bit timers, and two 16-bit low-power timers. These devices support four digital filters for external sigma delta modulators (DFSDM). Additionally, up to 24 capacitive sensing channels are available. The devices also embed an integrated LCD driver 8x40 or 4x44 with an internal boost converter. STM32L476xx operates from -40 to +85°C (+105°C junction), -40 to +105°C (+125°C junction) and -40 to +125°C (+130°C junction) temperatures The supply voltage range is 1.71 to 3.6 V VDD when using the internal LDO regulator, and 1.05 to 1.32 V VDD12 when using an external SMPS power supply. A comprehensive set of power-saving modes allows the design of low-power applications. Several independent power supplies are supported: analog independent power input for ADC, DAC, OPAMP, and comparator, dedicated 3.3 V power input for USB, and up to 14 I/Os that can be independently powered to 1.08 V. The VBAT input allows backup of the RTC and backup registers. When connected to an external SMPS, a dedicated VDD12 supply can be used to bypass the internal LDO regulator. The STM32L476xx family is available in six packages ranging from 64-pin to 144-pin packages.

2. Features

    1. Ultra-low-power with FlexPowerControl

        – 1.71 V to 3.6 V power supply

        – -40 °C to 85/105/125 °C temperature range

        – 300 nA in VBAT mode: supply for RTC and 32x32-bit backup registers

        – 30 nA Shutdown mode (5 wakeup pins)

        – 120 nA Standby mode (5 wakeup pins)

        – 420nA Standby mode with RTC

        – 1.1 µA Stop 2 mode, 1.4 µA with RTC

        – 100 µA/MHz run mode (LDO Mode)

        – 39 μA/MHz run mode (@3.3 V SMPS Mode)

        – Batch acquisition mode (BAM)

        – 4 µs wakeup from Stop mode

        – Brown out reset (BOR)

        – Interconnect matrix

    2. Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator allowing 0-wait-state execution from Flash memory, frequency up to 80 MHz, MPU, 100DMIPS and DSP instructions

    3. Performance benchmark

        – 1.25 DMIPS/MHz (Drystone 2.1)

        – 273.55 CoreMark® (3.42 CoreMark/MHz @ 80 MHz)

    4. Energy benchmark

        – 294 ULPMark™ CP score

        – 106 ULPMark™ PP score 

    5. Clock Sources

        – 4 to 48 MHz crystal oscillator

        – 32 kHz crystal oscillator for RTC (LSE)

        – Internal 16 MHz factory-trimmed RC (±1%)

        – Internal low-power 32 kHz RC (±5%)

        – Internal multispeed 100 kHz to 48 MHz oscillator, auto-trimmed by LSE (better than ±0.25 % accuracy)

        – 3 PLLs for system clock, USB, audio, ADC

    6. Up to 114 fast I/Os, most 5 V-tolerant, up to 14 I/Os with independent supply down to 1.08 V

    7. RTC with HW calendar, alarms and calibration

    8. LCD 8× 40 or 4× 44 with step-up converter

    9. Up to 24 capacitive sensing channels: support touchkey, linear and rotary touch sensors

  10. 16x timers: 2x 16-bit advanced motor-control, 2x 32-bit and 5x 16-bit general purpose, 2x 16-bit basic, 2x low-power 16-bit timers (available in Stop mode), 2x watchdogs, SysTick timer

  11. Memories

        – Up to 1 MB Flash, 2 banks read-whilewrite, proprietary code readout protection

        – Up to 128 KB of SRAM including 32 KB with hardware parity check

        – External memory interface for static memories supporting SRAM, PSRAM, NOR and NAND memories

        – Quad SPI memory interface

  12. 4x digital filters for sigma delta modulator

  13. Rich analog peripherals (independent supply)

        – 3x 12-bit ADC 5 Msps, up to 16-bit with hardware oversampling, 200 µA/Msps

        – 2x 12-bit DAC output channels, low-power sample and hold

        – 2x operational amplifiers with built-in PGA

        – 2x ultra-low-power comparators

  14. 20x communication interfaces

        – USB OTG 2.0 full-speed, LPM and BCD

        – 2x SAIs (serial audio interface)

        – 3x I2C FM+(1 Mbit/s), SMBus/PMBus

        – 5x USARTs (ISO 7816, LIN, IrDA, modem)

        – 1x LPUART (Stop 2 wake-up)

        – 3x SPIs (and 1x Quad SPI)

        – CAN (2.0B Active) and SDMMC interface

        – SWPMI single wire protocol master I/F

        – IRTIM (Infrared interface)

  15. 14-channel DMA controller

  16. True random number generator

  17. CRC calculation unit, 96-bit unique ID

  18. Development support: serial wire debug (SWD), JTAG, Embedded Trace Macrocell™

  19. All packages are ECOPACK2® compliant

3. Standard and advanced communication interfaces

    1. Three I2C

    2. Three SPIs

    3. Three USARTs, two UARTs and one low power UART.

    4. Two SAI (Serial Audio Interface)

    5. an SDMMC

    6. a jar

    7. One USB OTG full speed

    8. One SWPMI (Single Wire Protocol Master)

4. Digital interface features

    1. Up to two DAC output channels

    2. 8-bit or 12-bit output mode

    3. Buffer offset calibration (factory and user trimmed)

    4. Left or right data alignment in 12-bit mode

    5. Synchronous update capability

    6. Noise wave generation

    7. Triangle wave generation

    8. Independent or simultaneous conversion of dual DAC channels

    9. DMA capability per channel

  10. External trigger for conversion

  11. Sample and hold low power mode using internal or external capacitors

5. Analog to digital converter

    1. 12-bit native resolution with built-in calibration

    2. 5.33 Msps maximum conversion rate at full resolution

        – Sampling time as low as 18.75 ns

        – Improved conversion rate for lower resolutions (6-bit resolution up to 8.88 Msps)

    3. Up to 24 external channels, some of which are shared between ADC1 and ADC2 or ADC1, ADC2 and ADC3.

    4. 5 internal channels: internal voltage reference, temperature sensor, VBAT/3, DAC1_OUT1 and DAC1_OUT2.

    5. Some packages provide an external reference pin that allows input voltage Range independent of power supply

    6. Single-ended and differential mode inputs

    7. Low power design

        – Capable of low current operation with low slew rate

        – Dual clock domain architecture: ADC speed independent of CPU frequency

    8. Highly versatile digital interface

        – Single or continuous/discontinuous sequencer-based scan modes: 2 groups Analog signal conversion can be programmed to distinguish between background and High-priority real-time conversion

        – Processes two ADC converters for dual mode operation (simultaneous or interleaved sampling mode)

        – Each ADC supports multiple trigger inputs for synchronization with on-chip timers and external signals

        – Store results to 3 data registers or RAM with DMA controller support

        – Data preprocessing: left/right alignment and offset compensation per channel

        – Built-in oversampling unit for enhanced SNR

        – Channel programmable sampling time

        – Three analog watchdogs for automatic voltage monitoring, interrupt generation and trigger the selected timer

        – The hardware assistant prepares the context of the injected channel to allow fast context switch

6. Pin configuration

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