TC014-06001 Allicdata Electronics
Allicdata Part #:

259-1437-ND

Manufacturer Part#:

TC014-06001

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: Sunon Fans
Short Description: FAN CPU COOLER 98X80MM 12VDC
More Detail: Heat Sink Board Level
DataSheet: TC014-06001 datasheetTC014-06001 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: MagLev® TC
Part Status: Obsolete
Type: Board Level
Package Cooled: --
Attachment Method: Bolt On
Shape: Square, Fins
Length: 3.858" (98.00mm)
Width: 3.858" (98.00mm)
Diameter: --
Height Off Base (Height of Fin): 3.150" (80.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: --
Material Finish: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

The TC014-06001 is a small, lightweight product typically used in the cooling of electronic components. It is designed to dissipate thermal energy caused by heat transfer, and is an effective way of increasing cooling efficiency.

The TC014-06001 can be easily mounted onto any electronic device requiring enhanced thermal dissipation. Its size makes it particularly useful in applications where space is at a premium. The device itself is essentially a metal fin arraigned to form a heat sink; this fin helps to draw heat away from components by acting as a conduit for convective and radiative energy, which are then dissipated away from the circuit. A fan may be used to increase the cooling capability of a device, if desired.

As for its application field, the TC014-06001 is best suited for small, low-power circuits, such as those found in smartphones or other consumer electronics. These devices often require increased cooling efficiency due to their small physical size. The device is also well suited for medium-sized components, such as computer motherboards, as the metal fin help to spread the heat away from its source.

The working principle of the TC014-06001 is relatively simple and entails the use of thermal energy from the components being cooled. Heat is transferred from the component to the metal fins on the heat sink, where it is then dissipated into the surrounding air. The metal fin helps to increase the surface area exposed to the external air, allowing more heat to be radiated from the heat sink. Additionally, the use of a fan can help to increase the effect of air convection, allowing more heat to be dispersed.

The TC014-06001 is an effective device for cooling electronic components. Its small size allows it to be integrated into a variety of applications, while the metal fin helps to enhance thermal efficiency. Through convection and radiation, the heat sink is able to effectively dissipate heat away from the components, providing greater protection and increased reliability. Whether used as a primary cooling source, or an auxiliary device, the TC014-06001 provides an effective and efficient means of cooling electronic components.

The specific data is subject to PDF, and the above content is for reference

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