TMS5703135DPGEQQ1

Program Memory Size:	3MB (3M x 8)
Supplier Device Package:	144-LQFP (20x20)
Package / Case:	144-LQFP
Operating Temperature:	-40°C ~ 125°C (TA)
Oscillator Type:	External
Data Converters:	A/D 24x12b
Voltage - Supply (Vcc/Vdd):	1.14 V ~ 3.6 V
RAM Size:	256K x 8
EEPROM Size:	64K x 8
Program Memory Type:	FLASH
Series:	Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R
Number of I/O:	58
Peripherals:	DMA, POR, PWM, WDT
Connectivity:	CANbus, EBI/EMI, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
Speed:	160MHz
Core Size:	16/32-Bit
Core Processor:	ARM® Cortex®-R4F
Part Status:	Active
Packaging:	Tray

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Introduction

TMS5703135DPGEQQ1 is an integrated circuit designed and manufactured by Texas Instruments. TMS5703135DPGEQQ1 is a 8-bit microcontroller which operates at a minimum voltage of 1.8V and maximum voltage of 5.5V. The microcontroller has an extensive range of features and is widely used in embedded applications. The microcontroller is based on the TMS570 microcontroller architecture, and includes integrated peripherals such as timers, UARTs, SPI and I2C interfaces. The microcontroller also includes a power management and memory protection unit (PMU) to provide low power and secure operation.

Application Field

TMS5703135DPGEQQ1 is an ideal microcontroller for embedded applications. It is suited for applications which require low power operation, data protection and real-time operation. The microcontroller is used in consumer and industrial applications including:• Automotive applications such as engine control units and body control units• Sensors and Mobile devices such as ambient light, temperature, humidity and pressure sensors• Medical and safety applications such as heart rate and blood pressure monitors• Security and surveillance applications• Robotics and automated control systems• Home and building automation

Working Principle

The TMS5703135DPGEQQ1 is based on the TMS570 microcontroller architecture which incorporates a Harvard architecture. This architecture allows for simultaneous execution of both program code and data memory. The architecture is made of three distinct layers:• Hardware Layer – This is a collection of standard peripherals and integrated components such as timers, UARTs and I2C interfaces.• Firmware Layer – This is a middle layer which implements features such as interrupt handling, context switching, memory management, power management and security.• Application Layer – This layer is user-defined and implements the high-level functions which are specific to the application.The microcontroller is also equipped with a power management and memory protection unit (PMU) to provide low power operation and secure execution. The PMU has the ability to control the operating frequency and supply voltage, as well as monitor and control the memory usage. The PMU also provides secure execution by preventing access to sensitive memory and data.

Conclusion

In conclusion, the TMS5703135DPGEQQ1 is an ideal microcontroller for embedded applications which require low power operation, real-time operation and data protection. The microcontroller is based on the TMS570 microcontroller architecture and includes integrated peripherals such as timers, UARTs, SPI and I2C interfaces. Additionally, the microcontroller also includes a power management and memory protection unit (PMU) to provide low power and secure operation. The microcontroller is used in a wide range of consumer and industrial applications such as automotive applications, medical and safety applications, security and surveillance applications, robotics and automation, and home and building automation.

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