Allicdata Part #: | 294-1142-ND |
Manufacturer Part#: |
TXB2P-032-037ND |
Price: | $ 0.00 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CTS Thermal Management Products |
Short Description: | THERMAL LINK PRESSON NKL TO-5 |
More Detail: | Heat Sink TO-5 Brass Top Mount |
DataSheet: | TXB2P-032-037ND Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Specifications
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | TO-5 |
Attachment Method: | Press Fit, Bolt On |
Shape: | Cylindrical |
Length: | 0.370" (9.40mm) |
Width: | 0.380" (9.65mm) |
Diameter: | 0.380" (9.65mm) OD |
Height Off Base (Height of Fin): | -- |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 82.00°C/W |
Material: | Brass |
Material Finish: | Dull Nickel |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-Heat Sinks are devices designed to dissipate heat away from the critical components such as a CPU in a computer, an optoelectronic device, a LED, or an amplifier. The device is designed to conduct the heat away from the component and then to a metal clad baseplate where it will be dissipated into the atmosphere. The TXB2P-032-037ND is a state-of-the-art heat sink perfect for dissipating heat from components such as the ones mentioned above. The device consists of a finned aluminum body mounted to a baseplate that has a thermally Conductive coating on the bottom as well as on the fins of the body. The baseplate comes with pre-drilled mounting holes for easy installation. The fins of the body are also designed to provide better air flow around the component it is protecting and also increase the overall surface area for better heat dissipation.The TXB2P-032-037ND is used in a range of applications where the proper thermal management of components is required. These include computer systems, LED lighting systems, industrial automation, instrumentation systems, and optoelectronic systems. This product is designed with a unique fin design called Thermal-Spokes, which helps increase the overall surface area and effectively dissipates heat away from the component. The fin design features an extended tip which helps increase air flow around the component, allowing for the maximum thermal dissipation. The fin design also helps reduce the noise emitted by the device.The working principle of the TXB2P-032-037ND is simple, yet highly effective. When there is a high temperature source, such as a CPU in a computer, the heat generated by the component will be dissipated away from the source by the aluminum body and the thermally conductive coating on the fins and baseplate. The heat is then transferred away from the source into the baseplate where it is dissipated into the atmosphere. The fins on the body also increase the overall surface area allowing for better heat dissipation away from the source.The TXB2P-032-037ND is an efficient and reliable thermal-heat sink that is ideal for dissipating heat away from components such as a CPU in a computer or an optoelectronic device. The device consists of a finned aluminum body mounted to a baseplate that has a thermally Conductive coating on the bottom and fins. The fin design is optimized to provide maximum air flow and maximum surface area for better heat dissipation. The baseplate also comes with pre-drilled mounting holes for easy installation. The working principle of the device is simple yet highly effective in dissipating heat away from the component and into the atmosphere.
The specific data is subject to PDF, and the above content is for reference
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