TXBN0304RSVR Integrated Circuits (ICs)

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TXBN0304RSVR is a logic translator and Level shifter packaged in a Quad Flat No-Lead (QFN). This chip is designed to translate between logic levels that are based on different voltage standards. It features very low power dissipation comparable with other dedicated parts and it has a very small footprint of 4x4mm.

The chip has two dedicated translator and two output buffer sections.The first section is for direct translation between 1.8V and 3.3V. The second section outputs 3.3V from 1.8V or 1.8V from 3.3V. The third section is used for level shifting which can be adjusted with external level shifters. The fourth section is a bidirectional buffer driver providing very low output impedance and fast switching times.

TXBNO304RSVR is suitable for mobile and embedded applications needing low-voltage level shifting and translations. The chip is capable of translating most common logic families such as TTL, LVTTL, and LVCMOS. It has an operating temperature range of -40°C to +85°C, ideal for high temperature and cold temperature applications. It has low static power dissipation and negligible power dissipation when a logic level is driven into the output buffer. The chip features ESD protection of up to 2kV, making it suitable for applications requiring high EMI/RFI immunity.

The chip features a combinational logic interface, meaning that the output changes in a predictable manner as the input changes. This allows for fast switching speeds and easy integration into high speed differential signaling. The outputs are 5V tolerant, supporting direct connection to 5V devices. The chip is also TTL/CMOS compatible, allowing for easy integration into existing circuitry.

The TXBN0304RSVR has many advantages that make it an excellent choice for logic-level translation. It provides very low power consumption, along with fast switching speeds, high output drive capabilities and 5V tolerance. It also has a low EMI/RFI emission, and offers ESD protection of up to 2kV. Its small package size keeps board costs and space requirements to a minimum. The chip is suitable for a wide range of applications including mobile, embedded, automotive and industrial systems.

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