| Allicdata Part #: | TXP1808ND-ND |
| Manufacturer Part#: |
TXP1808ND |
| Price: | $ 0.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CTS Thermal Management Products |
| Short Description: | HEATSINK PRESS ON NICKEL TO-18 |
| More Detail: | Heat Sink TO-18 Brass Top Mount |
| DataSheet: |  TXP1808ND Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | 0.00000 |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | -- |
| Material: | Brass |
| Material Finish: | Dull Nickel |
| Series: | -- |
| Part Status: | Obsolete |
| Type: | Top Mount |
| Package Cooled: | TO-18 |
| Attachment Method: | Bolt On |
| Shape: | Cylindrical |
| Length: | 0.340" (8.64mm) |
| Width: | 0.220" (5.59mm) |
| Diameter: | 0.220" (5.59mm) OD |
| Height Off Base (Height of Fin): | -- |
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TXP1808ND is a heat sink component used in thermal management applications. It uses aluminum material, and is available in three different sizes to match the application needs. It has a large surface area and a high contact thermal resistance which helps reduce the heat generated by the system.
The TXP1808ND is a simple thermal heat sink component that has been designed to provide effective thermal management. It is compatible with most small- and mid-sized electronic devices. The product is a shallow mounting, semi-stateless, pin-fin heat sink. Its design provides better thermal conductivity than alternative designs, which results in reduced power dissipation and lower operating temperatures.
The working principle of the TXP1808ND heat sink lies in convection. Heat is drawn from the surface of the component by air currents created by the fins in the heat sink, which are spaced at a fixed distance apart. As the air passes through the fins, it carries away the heat from the component, and then escapes from the heat sink\'s cavity.
The TXP1808ND is a lightweight and efficient solution for thermal management of many small electronic devices. It is been often used in computers, printers, hard drives, graphics cards, and other devices that generate a significant amount of heat. It can be easily mounted on a heat sink platform and can accommodate a wide range of components, providing an efficient and reliable cooling solution.
The TXP1808ND heat sink can also be used for cooling other systems, such as power supplies, amplifiers, AC adapters, power blocks, and even certain computers. This makes the heat sink suitable for a multitude of applications. The device is also easy to install and maintain, making it a cost-effective choice for various applications.
Overall, the TXP1808ND is an efficient and reliable thermal heat sink component that can be used for various applications. It is lightweight, simple to install, and offers good thermal conductivity. The pin-fin design provides an effective convective heat transfer to dissipate the heat away from the component, which reduces the operating temperature of the device. This makes the TXP1808ND a cost-effective solution for thermal management.
The specific data is subject to PDF, and the above content is for reference