Allicdata Part #: | AE10777-ND |
Manufacturer Part#: |
V4330F |
Price: | $ 0.75 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEATSINK ALUM ANOD |
More Detail: | Heat Sink KLP Aluminum Board Level |
DataSheet: | V4330F Datasheet/PDF |
Quantity: | 199 |
1 +: | $ 0.68040 |
10 +: | $ 0.64890 |
25 +: | $ 0.63176 |
50 +: | $ 0.61463 |
100 +: | $ 0.58048 |
250 +: | $ 0.54634 |
500 +: | $ 0.51219 |
1000 +: | $ 0.47804 |
5000 +: | $ 0.46097 |
Series: | -- |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | KLP |
Attachment Method: | Bolt On |
Shape: | Rectangular, Fins |
Length: | 1.969" (50.00mm) |
Width: | 1.142" (29.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.453" (11.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 10.00°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are an integral part of all electronic components and systems. They help dissipate the heat generated by electrical components and applications. A V4330F Thermal - Heat Sink is a highly efficient heat sink that dissipates heat from components and applications in a highly effective manner. It is designed to be a thermal interface between a heat source and the ambient environment.
The V4330F Thermal - Heat Sink consists of a large aluminum base plate and heat column with an attached heat spreader. The base plate is designed to conduct heat from the heat source to the heat spreader, while the heat spreader ensures reliable thermal conduction and dissipation. The heat column is designed to effectively transport the heat spread away from the heat source, towards the ambient environment.
The V4330F Thermal - Heat Sink utilizes a unique diffused-zone technology that effectively distributes heat away from the heat source. It features a high surface area that is optimized to allow for maximum heat dissipation and effective cooling. This technology allows for more efficient cooling and better thermal performance in extreme temperature applications.
The V4330F Thermal - Heat Sink also features a heat pipe technology that enables rapid and effective thermal conduction from the heat source to the ambient environment. Heat pipes are a series of highly conductive metal pipes that efficiently move heat away from the source and towards the ambient environment. This technology ensures efficient cooling and increases thermal performance.
The V4330F Thermal - Heat Sink also employs a strategic mounting system that allows for a secure and reliable connection. This mounting system ensures that the Therma - Heat Sink stays in place without causing any damage to components or applications. The system also ensures that the heatsink makes efficient contact with the thermal source.
The V4330F Thermal - Heat Sink is capable of dissipating up to 320W of heat and is ideal for systems with complex heat requirements. It also features a high thermal conductivity of 5W/mk which allows for efficient heat transfer from the components to the heatsink. Furthermore, this Thermal - Heat Sink is designed to be both corrosion and chemical resistant. This ensures that the device will perform effectively in challenging environments.
Overall, the V4330F Thermal - Heat Sink is an efficient and reliable solution for dissipating heat from components and applications. It features a high surface area that is optimized for maximum heat dissipation and allows for efficient cooling in extreme temperature applications. The unique diffused-zone technology helps distribute heat away from the source, while the heat pipe ensures efficient thermal conduction. The mounting system allows for a secure and reliable connection. The device is corrosion and chemical resistance and provides up to 320W of heat dissipation. In conclusion, the V4330F Thermal - Heat Sink is an effective solution for dissipating heat from components and applications.
The specific data is subject to PDF, and the above content is for reference