Allicdata Part #: | AE10828-ND |
Manufacturer Part#: |
V5220L |
Price: | $ 0.79 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEATSINK ALUM ANOD TO-220 |
More Detail: | Heat Sink TO-220 Aluminum Board Level |
DataSheet: | V5220L Datasheet/PDF |
Quantity: | 4167 |
1 +: | $ 0.71820 |
10 +: | $ 0.67977 |
25 +: | $ 0.66200 |
50 +: | $ 0.64411 |
100 +: | $ 0.60833 |
250 +: | $ 0.57254 |
500 +: | $ 0.53676 |
1000 +: | $ 0.50098 |
5000 +: | $ 0.48308 |
Series: | -- |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On |
Shape: | Rectangular, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.260" (32.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.787" (19.99mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 8.00°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
- V5220L Application Field and Working Principle
The V5220L is a thermal heat sink that is designed and manufactured by Toshiba for cooling solutions. It is used in nearly all kinds of electronic equipment, such as computers, servers, TVs, etc., and is also suitable for industrial processes and other related applications. It is primarily designed to provide an efficient means of dissipating heat from a device, thus preventing it from becoming dangerously overheated.
The V5220L consists of two parts: a base plate and a fin plate. The base plate is a thick piece of aluminum with a series of grooves cut into it to permit adhesion of the fin plate. The fins are generally made of aluminum alloy with an electroplated finish. Heat is dissipated from the component or device by airflow or convective cooling; the finplate acts as the surface to which the air passes and extracts the heat. The fins provide the necessary surface area and are designed to maximize the air flow exchange to achieve optimal cooling performance.
In order to effectively cool a component using the V5220L, it must be installed in a specific manner. Firstly, the base plate must be mechanically attached to the component (through screws, clips, or rivets) and should fit tightly against it. To ensure maximum cooling efficiency, a thin layer of thermal conductive paste should be applied between the component and the base plate. The fin plate should then be placed on top of the base plate. It should be firmly secured with screws to ensure proper adhesion. Once the installation is completed, airflow can be induced to pass over the fins and dissipate the heat.
The V5220L can be used in numerous applications. Firstly, it can be used to cool components that generate a lot of heat due to their high power consumption. Secondly, the V5220L is also suitable for systems that are prone to thermal breakdowns needing more efficient cooling solutions. For example, if a server needs to be made more efficient, the V5220L can be used in order to help dissipate heat quickly and effectively.
Overall, the V5220L is an effective cooling solution for many electronic devices and systems. It is easy to install and requires minimal maintenance. The finplate’s design allows for maximum air flow exchange which enables the V5220L to efficiently dissipate heat from components and allow them to operate at optimum temperatures. It is often used in many industrial applications as well as home applications and is one of the best performing heat sinks in the market.
The specific data is subject to PDF, and the above content is for reference
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